F-217
QTH–090–01–C–D–A
®
QTH–030–01–L–D–A
QTH–060–07–F–D–A
(0.50 mm) .0197"
QTH SERIES
HIGH-SPEED GROUND PLANE HEADER
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?QTH
Insulator Material:
Liquid Crystal Polymer
Terminal Material:
Phosphor Bronze
Plating:
Au or Sn over 50 µ" (1.27 µm) Ni
Current Rating:
Contact:
2 A per pin
(1 pin powered per row)
Ground Plane:
25 A per ground plane
(1 ground plane powered)
Operating Temp Range:
-55 °C to +125 °C
Voltage Rating:
125 VAC (5 mm Stack Height)
Max Cycles: 100
RoHS Compliant: Yes
Integral metal plane for
power or ground
Board Mates:
QSH
Cable Mates:
HQCD, HQDP
(See Also Available Note)
Standard Stack Heights
from 5 mm to 25 mm
Standoffs:
SO
HIGH-SPEED CHANNEL PERFORMANCE
25
QTH/QSH @ 5 mm Mated Stack Height
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact SIG@samtec.com
10 YEAR MFG
WITH 50 µ" GOLD
EXTENDED LIFE
PRODUCT
HIGH MATING
CYCLES
G b p s
PROCESSING
Lead–Free Solderable: Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (030-060)
(0.15 mm) .006" max (090)
Board Stacking:
For applications requiring
more than two connectors per
board contact ipg@samtec.com
RECOGNITIONS
LEAD
STYLE
PINS PER ROW
NO. OF PAIRS
QTH
Specify
LEAD
STYLE
from
chart
–030, –060, –090
(60 total pins per bank = –D)
For complete scope of
recognitions see
www.samtec.com/quality
–020, –040, –060
(20 pairs per bank = –D–DP)
FILE NO. E111594
• 100 GbE
• Hypertransport™
• XAUI
• PCI Express®
• SATA
• InfiniBand™
ALSO AVAILABLE
(MOQ Required)
• 15 mm, 22 mm and
30 mm stack height
• 30 µ" (0.76 µm) Gold
(Specify -H plating
for Data Rate cable mating
applications.)
• Edge Mount & Guide Posts
• 80 (-DP), 120, 150
positions per row
• Retention Option
Contact Samtec.
–F
= Gold Flash on
Signal Pins and
Ground Plane,
Matte Tin on tails
= Single-Ended
–D–DP
= Differential Pair
(–01 only)
–C*
–DP = (No. of Pairs per Row/20) x (20.00) .7875
(20.00) .7875
01
(7.11)
.280
02
(0.50)
.0197
(0.20)
.008
A
A
–01 & –02
–03 thru –09
(0.76)
.030
(0.89)
.035
DIA
QTH
LEAD
STYLE
–01
= Electro-Polished
Selective
50 µ" (1.27 µm) min Au
over 150 µ" (3.81 µm)
Ni on Signal Pins in
contact area,
10 µ" (0.25 µm) min Au
over 50 µ" (1.27 µm)
Ni on Ground Plane
in contact area,
Matte Tin over 50 µ"
(1.27 µm) min Ni
on all solder tails
*Note: –C Plating passes
10 year MFG testing
–L
(0.64)
.025
–02
–03
–04
–05
–07
–09
WWW.SAMTEC.COM
Due to technical progress, all designs, specifications and components are subject to change without notice.
= (7.00 mm)
.275" DIA
Polyimide
film Pick &
Place Pad
(N/A with -05 &
-07 lead style)
–TR
A
(4.27)
.168
(7.26)
.286
(10.27)
.404
(15.25)
.600
(18.26)
.718
(24.24)
.954
(13.26)
.522
HEIGHT = Tape & Reel
WITH
(–090 positions
QSH*
maximum)
(5.00)
.197
(8.00)
.315
(11.00)
.433
(16.00)
.630
(19.00)
.748
(25.00)
.984
(14.00)
.551
*Processing conditions
will affect mated height.
See SO Series for
board space tolerances
Note: Some lengths, styles
and options are non-standard,
non-returnable.
OTHER
OPTION
–K
–D
= 10 µ" (0.25 µm)
Gold on Signal Pins
and Ground Plane,
Matte Tin on tails
–D = (No. of Pins per Row/30) x (20.00) .7875
A
TYPE
–L
FILE NO: 090871_0_000
PROTOCOLS
PLATING
OPTION
–L
= Latching
Option
(–01 lead
style only)
(N/A on
–060 (–D–DP)
& –090)
