0402 CHIP INDUCTORS
OutgassingCompliantChipInductors AR235RAA
30
120
110
100
27 nH
80
70
60
50
40
30
20
25
Inductance (nH)
90
10
20
0
-55 -40
19 nH
-20
0
20
40
60
80
100
120
140 160
Ambient temperature (°C)
15
12 nH
100
1000
E
terminal
Typical Q vs Frequency
110
12 nH
5.6 nH
19 nH
27 nH
100
90
80
1 nH
70
60
50
40
30
20
10
100
Frequency (MHz)
I
Terminal wraparound:
approx 0.007/0,18 both ends
Suggested
Land Pattern
A B
C D
max
max
max
ref E F G H I J
120
10
J
10000
Frequency (MHz)
1
I
F
0
0
Pick and
place
surface
G
A
1 nH
10
H
D
F
5.6 nH
1
C
B
overall
10
5
Q Factor
25°C
Typical L vs Frequency
Current Derating
Percent of rated Irms
■ Exceptionally high Q factors
■ Outstanding self-resonant frequency
■ Tight inductance tolerance
■ High temperature materials allow operation in ambient
temperatures up to 155°C.
■ Passes NASA low outgassing specifications
■ Standard tin-lead (Sn‑Pb) terminations over leach-resistant
base metalization ensures the best possible board adhesion
1000
10000
0.047 0.025 0.026 0.010 0.020 0.009 0.022 0.026 0.014 0.018
1,19 0,64 0,66 0,25 0,51 0,23 0,56 0,66 0,36 0,46
Note: Dimensions are before solder application. For maximum overall
dimensions including solder, add 0.0025 in / 0,064 mm to B and
0.006 in / 0,15 mm to A and C.
Core material Ceramic
Terminations Tin-lead (63/37) over silver-platinum-glass frit. Other
terminations are also available.
Ambient temperature –65°C to +125°C with Imax current, +125°C
to +155°C with derated current
Storage temperature Component: –65°C to +155°C.
Packaging: –55°C to +80°C
Resistance to soldering heat Max three 40 second reflows at
+260°C, parts cooled to room temperature between cycles
Temperature Coefficient of Inductance (TCL) +25 to +155 ppm/°C
Moisture Sensitivity Level (MSL) 1 (unlimited floor life at <30°C /
85% relative humidity)
Enhanced crush-resistant packaging 2000 per 7″ reel
Paper tape: 8 mm wide, 0.68 mm thick, 2 mm pocket spacing
Document AR198-2 Revised 08/25/15
