INTEGRATED CIRCUITS
74F37
Quad 2-input NAND buffer
Product specification
IC15 Data Handbook
Philips
Semiconductors
1990 May 24
Philips Semiconductors
Product specification
Quad 2-input NAND buffer
74F37
ABSOLUTE MAXIMUM RATINGS
(Operation beyond the limits set forth in this table may impair the useful life of the device.
Unless otherwise noted these limits are over the operating free-air temperature range.)
SYMBOL
PARAMETER
RATING
UNIT
VCC
Supply voltage
–0.5 to +7.0
V
VIN
Input voltage
–0.5 to +7.0
V
IIN
Input current
–30 to +5
mA
VOUT
Voltage applied to output in High output state
–0.5 to VCC
V
IOUT
Current applied to output in Low output state
Tamb
Operating free-air temperature range
Tstg
Storage temperature range
128
mA
0 to +70
°C
–65 to +150
°C
RECOMMENDED OPERATING CONDITIONS
LIMITS
SYMBOL
PARAMETER
UNIT
MIN
NOM
MAX
5.0
5.5
VCC
Supply voltage
4.5
V
VIH
High-level input voltage
2.0
VIL
Low-level input voltage
0.8
V
IIK
Input clamp current
–18
mA
IOH
High-level output current
–15
mA
IOL
Low-level output current
64
mA
Tamb
Operating free-air temperature range
+70
°C
V
0
DC ELECTRICAL CHARACTERISTICS
(Over recommended operating free-air temperature range unless otherwise noted.)
SYMBOL
VO
OH
LIMITS
TEST CONDITIONS1
PARAMETER
IO = –1mA
1mA
OH
VCC = MIN,
VIL = MAX
MAX,
VIH = MIN
High-level
High level output voltage
IO = –15mA
15mA
OH
VCC = MIN,
VIL = MAX
MAX,
VIH = MIN
VO
OL
Low-level
Low level output voltage
IO = MAX
OL
VIK
Input clamp voltage
Input current at maximum input voltage
IIH
High-level input current
IIL
Low-level input current
Short-circuit output current3
Supply current (total)
±10%VCC
2.0
±5%VCC
UNIT
2.0
V
3.4
V
±10%VCC
VCC = MAX
ICC
2.7
MAX
2.5
±5%VCC
TYP2
0.55
VCC = MAX, VI = 0.5V
IOS
±10%VCC
VCC = MIN, II = IIK
II
MIN
V
±5%VCC
ICCL
0.55
–0.73
–1.2
V
VCC = MAX, VI = 7.0V
100
µA
VCC = MAX, VI = 2.7V
ICCH
0.42
20
µA
–1.2
mA
–225
mA
–100
VIN = GND
3.0
6.0
VIN = 4.5V
VCC = MAX
23
33
mA
NOTES:
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.
2. All typical values are at VCC = 5V, Tamb = 25°C.
3. Not more than one output should be shorted at a time. For testing IOS, the use of high-speed test apparatus and/or sample-and-hold
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting
of a High output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any
sequence of parameter tests, IOS tests should be performed last.
May 24, 1990
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