MMBZ52xxBLT1 Series,
SZMMBZ52xxBLT1G Series
Zener Voltage Regulators
225 mW SOT−23 Surface Mount
This series of Zener diodes is offered in the convenient, surface
mount plastic SOT−23 package. These devices are designed to provide
voltage regulation with minimum space requirement. They are well
suited for applications such as cellular phones, hand held portables,
and high density PC boards.
http://onsemi.com
3
Cathode
Features
•
225 mW Rating on FR−4 or FR−5 Board
Zener Voltage Range − 2.4 V to 91 V
Package Designed for Optimal Automated Board Assembly
Small Package Size for High Density Applications
ESD Rating of Class 3 (>16 KV) per Human Body Model
AEC−Q101 Qualified and PPAP Capable
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
Pb−Free Packages are Available
Mechanical Characteristics
CASE: Void-free, transfer-molded, thermosetting plastic case
FINISH: Corrosion resistant finish, easily solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
MARKING
DIAGRAM
3
1
2
SOT−23
CASE 318
STYLE 8
xxx G
G
M
•
•
•
•
•
•
•
1
Anode
xxx
= Specific Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
260°C for 10 Seconds
POLARITY: Cathode indicated by polarity band
FLAMMABILITY RATING: UL 94 V−0
ORDERING INFORMATION
Device
MMBZ52xxBLT1
MAXIMUM RATINGS
Rating
Symbol
Total Power Dissipation on FR−5 Board,
(Note 1) @ TA = 25°C
Derated above 25°C
PD
Thermal Resistance,
Junction−to−Ambient
Total Power Dissipation on Alumina
Substrate, (Note 2) @ TA = 25°C
Derated above 25°C
RqJA
PD
Max
Unit
225
1.8
mW
mW/°C
556
°C/W
300
2.4
mW
mW/°C
°C/W
RqJA
417
Junction and Storage
Temperature Range
TJ, Tstg
−65 to +150
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−5 = 1.0 X 0.75 X 0.62 in.
2. Alumina = 0.4 X 0.3 X 0.024 in, 99.5% alumina.
November, 2011 − Rev. 10
1
Shipping†
SOT−23
3000/Tape & Reel
SOT−23 3000/Tape & Reel
(Pb−Free)
SZMMBZ52xxBLT1G SOT−23 3000/Tape & Reel
(Pb−Free)
MMBZ52xxBLT3
SOT−23
10,000/Tape &
Reel
SOT−23
(Pb−Free)
10,000/Tape &
Reel
SZMMBZ52xxBLT3G SOT−23
(Pb−Free)
10,000/Tape &
Reel
MMBZ52xxBLT3G
Thermal Resistance,
Junction−to−Ambient
© Semiconductor Components Industries, LLC, 2011
MMBZ52xxBLT1G
Package
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 3 of
this data sheet.
Publication Order Number:
MMBZ5221BLT1/D
