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部品型式

AXT360124

製品説明
仕様・特性

Automation Controls Catalog For board-to-board For board-to-FPC P4S Series Narrow pitch connectors (0.4mm pitch) FEATURES 1. Space-saving (3.6 mm widthwise) Smaller compared to P4 with soldering terminals (30 pin contacts): Socket — 38% smaller, Header — 34% smaller 3. Greater flexibility in connector placement. Pattern wiring to the connector bottom is made possible with a molded covering on the undersurface of the connector.

m m 35 2. m 6m 3. Socket Header RoHS compliant Pickup cover (Material: SUS) (Both covered and uncovered types are available.) Soldering terminals at each corner Socket Soldering terminals Soldering terminals at each corner at each corner Connector bottom: Create any thru-hole and pattern wiring. 8.70 (30 pin contacts) 4. Connectors for inspection available 5. Shield socket is also available. 3.60 Pickup cover (Material: LCP) (Both covered and uncovered types are available.) Soldering terminals at each corner Header APPLICATIONS Mobile devices, such as tablet PC, note PC, digital still cameras (DSC) and digital video cameras (DVC). 7.90 (30 pin contacts) 2.35 2. Strong resistance to adverse environments! Utilizes “ ” construction for high contact reliability. ORDERING INFORMATION AXT 4 3: Narrow Pitch Connector P4S (0.4 mm pitch) Socket 4: Narrow Pitch Connector P4S (0.4 mm pitch) Header Number of pins (2 digits) Mated height 1: For mated height 1.5 mm and 2.0 mm 2: For mated height 2.5 mm and 3.0 mm
1: For mated height 1.5 mm and 2.5 mm 2: For mated height 2.0 mm 3: For mated height 3.0 mm Functions 2: Without pickup cover, without positioning bosses 6: With pickup cover, without positioning bosses Surface treatment (Contact portion / Terminal portion) 4: Ni plating on base, Au plating on surface (for Ni barrier available)
4: Ni plating on base, Au plating on surface 2014.03 industrial.panasonic.com/ac/e/ –1– © Panasonic Corporation 2014 ACCTB14E 201403-T

ブランド

PANASONIC

会社名

パナソニック株式会社

本社国名

日本

事業概要

電子デバイス・産業用機器 受動部品、接続部品、センサ、変換部品、産業デバイス、プリント配線板/モジュール、素材・材料、半導体、記憶デバイス、電池・エネルギー機器、FA(実装、溶接、計測)、モータ・コンプレッサ

供給状況

 
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