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部品型式

MT9VDDT6472HY-335

製品説明
仕様・特性

128MB, 256MB, 512MB (x72, ECC, SR) 200-Pin DDR SDRAM SODIMM Features DDR SDRAM SODIMM MT9VDDT1672H – 128MB1 MT9VDDT3272H – 256MB MT9VDDT6472H – 512MB For component data sheets, refer to Micron’s Web site: www.micron.com Features Figure 2: • 200-pin, small-outline dual in-line memory module (SODIMM) • Fast data transfer rates: PC2100, PC2700, or PC3200 • 128MB (16 Meg x 72), 256MB (32 Meg x 72), and 512MB (64 Meg x 72) • Supports ECC error detection and correction • VDD = VDDQ = +2.5V (-40B: VDD = VDDQ = +2.6V) • VDDSPD = +2.3V to +3.6V • 2.5V I/O (SSTL_2-compatible) • Internal, pipelined double data rate (DDR) architecture; two data accesses per clock cycle • Bidirectional data strobe (DQS) transmitted/ received with data—that is, source-synchronous data capture • Differential clock inputs (CK and CK#) • Multiple internal device banks for concurrent operation • Selectable burst lengths (BL) 2, 4, or 8 • Auto precharge option • Auto refresh and self refresh modes: 15.625µs (128MB) and 7.8125µs (256MB, 512MB) maximum average periodic refresh interval • Serial presence-detect (SPD) with EEPROM • Selectable CAS latency (CL) for maximum compatibility • Single rank • Gold edge contacts PCB height: 38.10mm (1.5in) Options Marking • Operating temperature2 – Commercial (0°C ≤ TA ≤ +70°C) None – Industrial (–40°C ≤ TA ≤ +85°C) I • Package – 200-pin DIMM (standard) G – 200-pin DIMM (Pb-free) Y • Memory clock, speed, CAS latency – 5.0ns (200 MHz), 400 MT/s, CL = 3.0 -40B – 6.0ns (167 MHz), 333 MT/s, CL = 2.5 -335 – 7.5ns (133 MHz), 266 MT/s, CL = 2.03 -262 – 7.5ns (133 MHz), 266 MT/s, CL = 2.03 -26A – 7.5ns (133 MHz), 266 MT/s, CL = 2.53 -265 Notes: 1. End of life. 2. Contact Micron for industrial temperature module offerings. 3. Not recommended for new designs. 200-Pin SODIMM (MO-224) Figures Figure 1: Standard Layout Low-Profile Layout PCB height: 31.75mm (1.25in) PDF: 09005aef80804052/Source: 09005aef806e057b DD9C16_32_64x72H.fm - Rev. E 1/08 EN 1 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2004 Micron Technology, Inc. All rights reserved. Products and specifications discussed herein are subject to change by Micron without notice.

ブランド

MICRON

会社名

Micron Technology

本社国名

U.S.A

事業概要

メモリ・ストレージ用の各種半導体メモリ(DRAMやフラッシュメモリとそれらの搭載製品群)を製造・販売している。主力製品は、DRAM, FLASH MEMORY

供給状況

 
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