Tantalum Hermetically Sealed/Axial Through-Hole Capacitors
T225 Series High Temperature Solder
Overview
The KEMET T225 High Temperature Solder Series of solid
tantalum capacitors is especially designed for miniaturization
and employs a unique glass-to-metal compression end seal that
has no protruding eyelet. This flush end seal construction ideally
suits the T225 Series for all miniature high density packaging
applications. The capacitors consist of a dry porous tantalum
pellet, hermetically sealed in a solder coated metal case with
solder coated alloy 52 and solder coated nickel.
The internal design of these devices, as well as the hermetic
seal, includes high temperature solder (minimum melting point of
221°C). The content of tin in the solder does not exceed 97%. This
assembly is especially suited for temperature conditions where
solder may fail due to undesirable solder reflow.
Benefits
Applications
• Internal construction solder to resist up to 221ºC
• Qualified to MIL–PRF–39003, Style CSR09
• Failure rate options: Graded - B, C, D, and G, and
Exponential - M, P, R, and S
• Surge current options D, E, and F
• Operating temperature range of -55˚C to +125˚C
• Capacitance values of 0.047 μF to 18 μF
• Tolerances of ±5%, and ±10%
• Voltage rating of 6 – 75 VDC
• Case sizes: A and B
• Taped and reeled per EIA Specification RS–296
• Marking per MIL–STD–1285
KEMET's T225 High Temperature Solder Series of solid tantalum
capacitors is especially designed for miniaturization.
The T225 series is approved to all ratings and failure rates of MIL–
PRF–39003/2.
One world. One KEMET
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
T2065_T225 • 10/29/2013
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