XH3
Half-pitch Fine-fit and Stacking Connectors
Half-pitch Fine-fit Connectors Achieve
High-density Mounting without
Soldering
■ Solderless connection eliminates soldering and
washing processes.
■ Multi-level stacking conserves board space.
■ Requires half the space of conventional DIN con-
nectors (OMRON’s XC5B).
■ At a stacking height of 16.8 mm, the XH3 can be
stacked together with DIN connectors.
■ Mates with conventional XH3-series Half-pitch
Connectors.
(See the Mating Diagram on page 4.)
■ Allows press fitting using commercial tools.
RoHS Compliant
■ Terminology
Ordering Information
• Fine-fit
Refers to a press-fit connection using Omron's own terminal shape.
■ Ratings and Characteristics
• Solderless connection
Refers to a solderless electric connection of a connector, electric cable and printed circuit board. It involves
crimping, IDC pressing, press-fitting (fine-fit), etc. A
solderless connection generally refers to a press-fit connection.
• Stacking
Connects the printed-wiring boards parallel to each other.
The distance between the boards here is called "stacking height".
Rated current
0.5 A
Rated voltage
125 VAC
Contact resistance (See note.) 40 mΩ max. (at 20 mV, 100 mA max.)
Insulation resistance
1,000 MΩ min. (at 500 VDC)
Dielectric strength
650 VAC for 1 min (leakage current: 1 mA max.)
Total insertion force
0.78 N max. per contact
Total removal force
0.05 N min. per contact
Insertion durability
50 times
Ambient operating temperature Operating: −55 to 105°C (with no icing)
Note:
The contact resistance is for the XH3B-013P-D32 combined with the XH3B-013P-D5F (with the XH3B-013PD32 terminal used as the plug).
■ Materials and Finish
Connector
Housing
PBT resin with glass (UL94V-0)/gray
Locator
Contacts
Polyester elastomer (UL94V-0)/black
Socket
Copper alloy/nickel base,
0.15-µm gold plating
Short terminal
Copper alloy/nickel base,
gold flash plating
Backplane terminal
Copper alloy/nickel base,
0.15-µm gold plating
Backplane connector housing/
PBT resin with glass
short terminal connector rear cover (UL94V-0)/gray
■ Applicable Fine-fit PCBs
PCB thickness
1.6 mm
Through
holes
0.5±0.05 mm diameter (drill bit diameter 0.55+0.05 mm)
Finished diameter
Plating speci- 5 µm min. solder with 25 µm min. copfications
per base
PCB materials
Glass-epoxy board
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