Product Obsolete or Under Obsolescence
R
XC4000E and XC4000X Series Field Programmable Gate Arrays
XC4000E Electrical Specifications
Definition of Terms
In the following tables, some specifications may be designated as Advance or Preliminary. These terms are defined as
follows:
Advance:
Initial estimates based on simulation and/or extrapolation from other speed grades, devices, or device
families. Values are subject to change. Use as estimates, not for production.
Preliminary:
Based on preliminary characterization. Further changes are not expected.
Unmarked:
Specifications not identified as either Advance or Preliminary are to be considered Final.
Except for pin-to-pin input and output parameters, the a.c. parameter delay specifications included in this document are
derived from measuring internal test patterns. All specifications are representative of worst-case supply voltage and junction
temperature conditions.
All specifications subject to change without notice.
XC4000E DC Characteristics
Absolute Maximum Ratings
Symbol
VCC
VIN
VTS
TSTG
TSOL
TJ
Description
Supply voltage relative to GND
Input voltage relative to GND (Note 1)
Voltage applied to 3-state output (Note 1)
Storage temperature (ambient)
Maximum soldering temperature (10 s @ 1/16 in. = 1.5 mm)
Ceramic packages
Junction Temperature
Plastic packages
Value
-0.5 to +7.0
-0.5 to VCC +0.5
-0.5 to VCC +0.5
-65 to +150
+260
+150
+125
Units
V
V
V
°C
°C
°C
°C
Note 1: Maximum DC excursion above Vcc or below Ground must be limited to either 0.5 V or 10 mA, whichever is easier to
achieve. During transitions, the device pins may undershoot to -2.0 V or overshoot to VCC + 2.0 V, provided this over or
undershoot lasts less than 10 ns and with the forcing current being limited to 200 mA.
Note:
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those listed under
Recommended Operating Conditions is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods
of time may affect device reliability.
Recommended Operating Conditions
Symbol
VCC
Description
Supply voltage relative to GND, TJ = -0 °C to +85°C
Supply voltage relative to GND, TJ = -40°C to +100°C
Supply voltage relative to GND, TC = -55°C to +125°C
VIH
High-Level Input Voltage
VIL
Low-Level Input Voltage
TIN
Notes:
Commercial
Industrial
Military
TTL inputs
CMOS inputs
TTL inputs
CMOS inputs
Min
4.75
4.5
4.5
2.0
70%
0
0
Input signal transition time
Max
5.25
5.5
5.5
VCC
100%
0.8
20%
250
Units
V
V
V
V
VCC
V
VCC
ns
At junction temperatures above those listed above, all delay parameters increase by 0.35% per °C.
Input and output measurement thresholds for TTL are 1.5 V and for CMOS are 2.5 V.
February 11, 2000 (Version 1.8)
6-101
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