1GB, 2GB, 4GB (x64, SR) 204-Pin DDR3L SODIMM
Features
1.35V DDR3L SDRAM SODIMM
MT8KTF12864HZ – 1GB
MT8KTF25664HZ – 2GB
MT8KTF51264HZ – 4GB
Features
Figure 1: 204-Pin SODIMM (MO-268 R/C B2, B4)
• DDR3L functionality and operations supported as
defined in the component data sheet
• 204-pin, small-outline dual in-line memory module
(SODIMM)
• Fast data transfer rates: PC3-14900, PC3-12800,
PC3-10600, PC3-8500, or PC3-6400
• 1GB (128 Meg x 64), 2GB (256 Meg x 64), 4GB (512
Meg x 64)
• VDD = 1.35V (1.283–1.45V)
• VDD = 1.5V (1.425–1.575V)
• Backward compatible with standard 1.5V (±0.075V)
DDR3 systems
• VDDSPD = 3.0–3.6V
• Nominal and dynamic on-die termination (ODT) for
data, strobe, and mask signals
• Single rank
• Fixed burst chop (BC) of 4 and burst length (BL) of 8
via the mode register set (MRS)
• On-board I2C serial presence-detect (SPD) EEPROM
• Gold edge contacts
• Halogen-free
• Fly-by topology
• Terminated control, command, and address bus
Module height: 30mm (1.181in)
Options
Marking
• Operating temperature
– Commercial (0°C ≤ T A ≤ +70°C)
• Package
– 204-pin DIMM (halogen-free)
• Frequency/CAS latency
– 1.07ns @ CL = 13 (DDR3-1866)
– 1.25ns @ CL = 11 (DDR3-1600)
– 1.5ns @ CL = 9 (DDR3-1333)
– 1.87ns @ CL = 7 (DDR3-1066)
None
Z
-1G9
-1G6
-1G4
-1G1
Table 1: Key Timing Parameters
Data Rate (MT/s)
Speed
Industry
Grade Nomenclature
tRCD
CL =
13
CL =
11
CL =
10
CL = 9
CL = 8
CL = 7
CL = 6
tRP
tRC
CL = 5
(ns)
(ns)
(ns)
-1G9
PC3-14900
1866
1600
1333
1333
1066
1066
800
667
13.125
13.125
47.125
-1G6
PC3-12800
–
1600
1333
1333
1066
1066
800
667
13.125
13.125
48.125
-1G4
PC3-10600
–
–
1333
1333
1066
1066
800
667
13.125
13.125
49.125
-1G1
PC3-8500
–
–
–
–
1066
1066
800
667
13.125
13.125
50.625
-1G0
PC3-8500
–
–
–
–
1066
–
800
667
15
15
52.5
-80B
PC3-6400
–
–
–
–
–
–
800
667
15
15
52.5
PDF: 09005aef84577368
ktf8c128_256_512x64hz.pdf - Rev. H 04/13 EN
1
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© 2011 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.