MC14521B
24−Stage Frequency Divider
The MC14521B consists of a chain of 24 flip−flops with an input
circuit that allows three modes of operation. The input will function as a
crystal oscillator, an RC oscillator, or as an input buffer for an external
oscillator. Each flip−flop divides the frequency of the previous flip−flop
by two, consequently this part will count up to 224 = 16,777,216. The
count advances on the negative going edge of the clock. The outputs of
the last seven−stages are available for added flexibility.
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MARKING
DIAGRAMS
Features
• All Stages are Resettable
• Reset Disables the RC Oscillator for Low Standby Power Drain
• RC and Crystal Oscillator Outputs Are Capable of Driving External
•
•
•
•
•
Loads
Test Mode to Reduce Test Time
VDD′ and VSS′ Pins Brought Out on Crystal Oscillator Inverter to
Allow the Connection of External Resistors for Low−Power Operation
Supply Voltage Range = 3.0 Vdc to 18 Vdc
Capable of Driving Two Low−Power TTL Loads or One Low−Power
Schottky TTL Load over the Rated Temperature Range
Pb−Free Packages are Available*
MAXIMUM RATINGS (Voltages Referenced to VSS)
Parameter
PDIP−16
P SUFFIX
CASE 648
Value
−0.5 to +18.0
V
Vin, Vout
−0.5 to VDD
+0.5
V
Input or Output Current (DC or Transient)
per Pin
Iin, Iout
± 10
mA
Power Dissipation, per Package (Note 1)
PD
500
SOIC−16
D SUFFIX
CASE 751B
1
TA
−55 to +125
°C
Storage Temperature Range
Tstg
−65 to +150
°C
Lead Temperature (8−Second Soldering)
TL
260
°C
16
14521BG
AWLYWW
1
16
SOEIAJ−16
F SUFFIX
CASE 966
MC14521B
ALYWG
1
mW
Ambient Temperature Range
1
Unit
VDD
MC14521BCP
AWLYYWWG
1
1
Symbol
16
DC Supply Voltage Range
Input or Output Voltage Range
(DC or Transient)
A
WL, L
YY, Y
WW, W
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Temperature Derating: Plastic “P and D/DW”
Packages: – 7.0 mW/_C From 65_C To 125_C
This device contains protection circuitry to guard against damage due to high
static voltages or electric fields. However, precautions must be taken to avoid
applications of any voltage higher than maximum rated voltages to this
high−impedance circuit. For proper operation, Vin and Vout should be constrained
to the range VSS v (Vin or Vout) v VDD.
Unused inputs must always be tied to an appropriate logic voltage level
(e.g., either VSS or VDD). Unused outputs must be left open.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2006
June, 2006 − Rev. 6
1
Publication Order Number:
MC14521B/D