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部品型式

EXBE10C102J

製品説明
仕様・特性

Chip Resistor Networks Chip Resistor Networks Type: EXBD:1206 EXBE:1608 EXBA:2512 EXBQ:1506 ■ Features ● High density placing for digital signal circuits · Bussed 8 or 15 resistors for pull up/down circuits EXBD: 3.2 mm × 1.6 mm × 0.55 mm, 0.635 mm pitch EXBE: 4.0 mm × 2.1 mm × 0.55 mm, 0.8 mm pitch EXBA: 6.4 mm × 3.1 mm × 0.55 mm, 1.27 mm pitch EXBQ: 3.8 mm × 1.6 mm × 0.45 mm, 0.5 mm pitch · Available direct placing on the bus line by means of half pitch spacing without through-holes on PWB (“High density placing” is shown below) ● High speed mounting using conventional placing machine ● Reference Standard…IEC 60115-9, JIS C 5201-9, EIAJ RC-2130 ● RoHS compliant Pull up resistors Direct placement on the bus line VCC EXBE10C EXBA10P VCC VCC IC IC IC IC IC IC No through hole Through holes 0.4 mm pitch 0.635 mm pitch ■ Packaging Methods, Land Pattern, Soldering Conditions and Safety Precautions Please see Data Files ■ Explanation of Part Numbers 1 Product Code Thick Film Resistor Network 2 3 4 Dimension Code of Chip Resistor Network Type: inches D : 1206 E : 1608 A : 2512 Q : 1506 Dimensions 3.2 mm 1.6 mm 4.0 mm 2.1 mm 6.4 mm 3.1 mm 3.8 mm 1.6 mm Number of Terminals 10(EXBD,E,A) 16(EXBQ) 5 6 7 Circuit Configuration Code C P P E Common Terminal Position Center common circuit (EXBD, EXBE) Diagonal common circuit (Terminal 5 and Terminal 10) (EXBA) One side common circuit (Terminal 16) (EXBQ) Diagonal common circuit (Terminal 1 and Terminal 6) (EXBA) 8 9 10 Resistance Value The first two digits are significant figures of resistance value and the third one denotes the number of zeros following. 11 Resistance Tolerance ±5 % J 12 Suffix for Special Requirements Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 01 Aug. 2012 36

ブランド

PANASONIC

会社名

パナソニック株式会社

本社国名

日本

事業概要

電子デバイス・産業用機器 受動部品、接続部品、センサ、変換部品、産業デバイス、プリント配線板/モジュール、素材・材料、半導体、記憶デバイス、電池・エネルギー機器、FA(実装、溶接、計測)、モータ・コンプレッサ

供給状況

 
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