1997-3/25
MITSUBISHI LSIs
M5M51008BP,FP,VP,RV,KV,KR -55L,-70L,-10L,
-55LL,-70LL,-10LL
1048576-BIT(131072-WORD BY 8-BIT)CMOS STATIC RAM
DESCRIPTION
PIN CONFIGURATION (TOP VIEW)
ADDRESS
INPUTS
FEATURES
Power supply current
Type name
M5M51008BP,FP,VP,RV,KV,KR-55L
M5M51008BP,FP,VP,RV,KV,KR-70L
M5M51008BP,FP,VP,RV,KV,KR-10L
M5M51008BP,FP,VP,RV,KV,KR-55LL
M5M51008BP,FP,VP,RV,KV,KR-70LL
M5M51008BP,FP,VP,RV,KV,KR-10LL
Access time
(max)
55ns
70ns
100ns
55ns
70ns
100ns
Active
(1MHz)
(max)
15mA
stand-by
(max)
100µA
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
VCC
ADDRESS
A15 INPUT
S2 CHIP SELECT
INPUT
W WRITE CONTROL
INPUT
A13
A8
ADDRESS
INPUTS
A9
A11
OE OUTPUT ENABLE
INPUT
A10 ADDRESS
INPUT
S1 CHIP SELECT
INPUT
DQ8
DQ7
DQ6 DATA
INPUTS/
DQ5 OUTPUTS
DQ4
0.3µA
(Vcc=3.0V,typ)
A11
A9
A8
A13
W
1
32
2
31
3
30
OE
A10
S1
4
29
DQ8
5
28
DQ7
S2
A15
VCC
NC
A16
A14
A12
A7
A6
(Vcc=5.5V)
Single +5V power supply
Low stand-by current 0.3µA (typ.)
Directly TTL compatible : All inputs and outputs
Easy memory expansion and power down by S1,S2
Data hold on +2V power supply
Three-state outputs : OR - tie capability
OE prevents data contention in the I/O bus
Common data I/O
Package
M5M51008BP
············ 32pin 600mil DIP
M5M51008BFP
············ 32pin 525mil SOP
M5M51008BVP,RV ············ 32pin 8 X 20 mm 2 TSOP
M5M51008BKV,KR ············ 32pin 8 X 13.4 mm 2 TSOP
32
Outline 32P4(P), 32P2M-A(FP)
(Vcc=5.5V)
20µA
15mA
DATA
INPUTS/
OUTPUTS
NC 1
A16 2
A14 3
A12 4
5
A7
6
A6
7
A5
8
A4
9
A3
A2 10
A1 11
A0 12
DQ1 13
DQ2 14
DQ3 15
GND 16
M5M51008BP,FP
The M5M51008BP,FP,VP,RV,KV,KR are a 1048576-bit CMOS
static RAM organized as 131072 word by 8-bit which are
fabricated using high-performance triple polysilicon CMOS
technology. The use of resistive load NMOS cells and CMOS
periphery result in a high density and low power static RAM.
They are low standby current and low operation current and ideal
for the battery back-up application.
The M5M51008BVP,RV,KV,KR are packaged in a 32-pin thin
small outline package which is a high reliability and high density
surface mount device(SMD).Two types of devices are available.
VP,KV(normal lead bend type package),RV,KR(reverse lead bend
type package). Using both types of devices, it becomes very easy
to design a printed circuit board.
6
27
7
26
DQ6
DQ5
DQ4
GND
DQ3
DQ2
A5
A4
8
M5M51008BVP,KV
25
9
24
10
23
11
22
12
21
13
20
14
19
15
18
16
17
APPLICATION
DQ1
A0
A1
A2
A3
Outline 32P3H-E(VP), 32P3K-B(KV)
Small capacity memory units
A4
A5
A6
16
17
15
18
14
19
A7
A12
A14
A16
NC
VCC
13
20
12
21
11
22
10
23
8
25
A15
S2
7
26
6
27
W
A13
A8
5
28
4
29
3
30
A9
A11
2
31
1
32
9
M5M51008BRV,KR
24
A3
A2
A1
A0
DQ1
DQ2
DQ3
GND
DQ4
DQ5
DQ6
DQ7
DQ8
S1
A10
OE
Outline 32P3H-F(RV), 32P3K-C(KR)
NC : NO CONNECTION
1
MITSUBISHI
ELECTRIC
