LSH–030–01–G–D–A
F-217
LSH–050–01–G–D–A
LSH–010–01–G–D–A
LTH–010–01–G–D–A
LTH–030–01–G–D–A
LTH–050–01–G–D–A
(0.50 mm) .0197"
LTH, LSH SERIES
LOW PROFILE BLADE AND BEAM
LTH Mates with:
LSH
LSH Mates with:
LTH
NO. OF POSITIONS
PER ROW
LTH
PLATING
OPTION
01
D
OTHER
OPTION
A
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?LTH or
www.samtec.com?LSH
Insulator Material:
Liquid Crystal
Polymer
Terminal Material:
Phosphor Bronze
Contact Material:
BeCu
Plating:
Au over 50 µ" (1.27 µm) Ni
Operating Temp Range:
-55 °C to +125 °C
RoHS Compliant:
Yes
–K
–G
–010, –020, –030, –040, –050
= (5.50 mm) .217" DIA
Polyimide Film
Pick & Place Pad
= 10 µ" (0.25 µm)
Gold
(No. of positions per row +2)
x (0.50) .01969 + (2.79) .110
01
–TR
= Tape and Reel
(1.27)
.050
(0.76)
.030
(4.80)
.189
02
(0.20)
.008
(0.50)
.01969
PROCESSING
(1.68)
.066
(1.55)
.061
(0.89)
.035
(0.76)
.030
DIA
(No. of positions per row +2)
x (0.50) .01969 + (1.27) .050
Lead-Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max
Board Stacking:
For applications requiring more
than two connectors per board,
contact ipg@samtec.com
(5.05)
.199
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
NO. OF POSITIONS
PER ROW
LSH
01
PLATING
OPTION
D
A
OTHER
OPTION
FILE NO. E111594
–010, –020, –030, –040, –050
MATED HEIGHT
LEAD
STYLE
–01
(No. of positions per row + 2)
x (0.50) .01969 + (4.06) .160
(0.74)
.029
02
MATED
HEIGHT*
(2.31) .091
*Processing conditions will
affect mated height.
–G
= 10 µ" (0.25 µm)
Gold
–TR
= Tape and Reel
(1.22)
.048
(6.50)
.256
01
(0.50)
.01969
(0.15)
.006
(1.91)
.075
(0.89)
.035
(No. of positions per row + 2)
x (0.50) .01969 + (1.91) .075
–K
= (7.50 mm) .295" DIA
Polyimide Film Pick &
Place Pad
(0.76)
.030
DIA
(6.73)
.265
Note: Some lengths,
styles and options are
non-standard, non-returnable.
WWW.SAMTEC.COM
Due to technical progress, all designs, specifications and components are subject to change without notice.
