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部品型式

ABA-53563-TR1G

製品説明
仕様・特性

Agilent ABA-53563 3.5 GHz Broadband Silicon RFIC Amplifier Data Sheet Features • Operating frequency: DC ~ 3.5 GHz • 21.5 dB gain • VSWR < 2.0 throughout operating frequency • 12.7 dBm output P1dB Description Agilent’s ABA-53563 is an economical, easy-to-use, internally 50-ohm matched silicon monolithic amplifier that offers excellent gain and flat broadband response from DC to 3.5 GHz. Packaged in an ultraminiature industry-standard SOT-363 package, it requires half the board space of a SOT-143 package. ABA-53563 is fabricated using Agilent’s HP25 silicon bipolar process, which employs a doublediffused single polysilicon process with self-aligned submicron emitter geometry. The process is capable of simultaneous high fT and high NPN breakdown (25 GHz fT at 6V BVCEO). The process utilizes industry standard device oxide isolation technologies and submicron aluminum multilayer interconnect to achieve superior performance, high uniformity, and proven reliability. • Unconditionally stable • Single 5V supply (Id = 46 mA) • Lead-free option available Applications • Amplifier for cellular, cordless, special mobile radio, PCS, ISM, wireless LAN, DBS, TVRO, and TV tuner applications Pin Connections and Package Marking GND 1 GND 2 3Hx At 2 GHz, the ABA-53563 offers a small-signal gain of 21.5 dB, output P1dB of 12.7 dBm and 22.9 dBm output third order intercept point. It is suitable for use as buffer amplifiers for wideband applications. They are designed for low cost gain blocks in cellular applications, DBS tuners, LNB and other wireless communications systems. • 3.5 dB noise figure Surface Mount Package SOT-363/SC70 Input Output & Vcc GND 3 Vcc Note: Top View. Package marking provides orientation and identification. “x” is character to identify date code. Attention: Observe precautions for handling electrostatic sensitive devices. ESD Machine Model (Class A) ESD Human Body Model (Class 1A) Refer to Agilent Application Note A004R: Electrostatic Discharge Damage and Control. Simplified Schematic Vcc RF Output & Vcc RF Input Ground 2 Ground 3 Ground 1

ブランド

AVAGO

現況

2016, Avago Technologies acquires Broadcom Corp. and Broadcom Limited is formed

会社名

Avago Technologies, Inc.

事業概要

ヒューレット・パッカード(HP)、アジレント・テクノロジーの半導体部品部門を前身として、2005年12月に高周波半導体部品および光応用製品のパイオニア、アバゴ・テクノロジーとして新たなスタートを切りました。 光応用製品および高周波半導体部品のパイオニアとして40年という豊富な経験と実績を有しています。

供給状況

 
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