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CY7C185-20PC

製品説明
仕様・特性

1bCY7C185 CY7C185 8K x 8 Static RAM Functional Description[1] Features • High speed The CY7C185 is a high-performance CMOS static RAM organized as 8192 words by 8 bits. Easy memory expansion is provided by an active LOW chip enable (CE1), an active HIGH chip enable (CE2), and active LOW output enable (OE) and tri-state drivers. This device has an automatic power-down feature (CE1 or CE2), reducing the power consumption by 70% when deselected. The CY7C185 is in a standard 300-mil-wide DIP, SOJ, or SOIC package. — 15 ns • Fast tDOE • Low active power — 715 mW • Low standby power — 85 mW An active LOW write enable signal (WE) controls the writing/reading operation of the memory. When CE1 and WE inputs are both LOW and CE2 is HIGH, data on the eight data input/output pins (I/O0 through I/O7) is written into the memory location addressed by the address present on the address pins (A0 through A12). Reading the device is accomplished by selecting the device and enabling the outputs, CE1 and OE active LOW, CE2 active HIGH, while WE remains inactive or HIGH. Under these conditions, the contents of the location addressed by the information on address pins are present on the eight data input/output pins. • CMOS for optimum speed/power • Easy memory expansion with CE1, CE2 and OE features • TTL-compatible inputs and outputs • Automatic power-down when deselected • Available in non Pb-free 28-pin (300-Mil) Molded SOJ, 28-pin (300-Mil) Molded SOIC and both Pb-free and non Pb-free in 28-pin (300-Mil) Molded DIP The input/output pins remain in a high-impedance state unless the chip is selected, outputs are enabled, and write enable (WE) is HIGH. A die coat is used to insure alpha immunity. Logic Block Diagram Pin Configurations DIP/SOJ Top View I/O0 INPUT BUFFER I/O2 SENSE AMPS A1 A2 A3 A4 A5 A6 A7 A8 ROW DECODER I/O1 8K x 8 ARRAY I/O3 I/O4 I/O5 I/O6 CE1 CE2 WE COLUMN DECODER POWER DOWN NC A4 A5 A6 A7 A8 A9 A10 A11 A12 I/O0 I/O1 I/O2 GND 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 VCC WE CE2 A3 A2 A1 OE A0 CE1 I/O7 I/O6 I/O5 I/O4 I/O3 I/O7 A12 A11 A10 A0 A9 OE Selection Guide -15 15 130 15 Maximum Access Time (ns) Maximum Operating Current (mA) Maximum CMOS Standby Current (mA) -20 20 110 15 -25 25 100 15 -35 35 100 15 Notes: 1. For guidelines on SRAM system design, please refer to the ‘System Design Guidelines’ Cypress application note, available on the internet at www.cypress.com. Cypress Semiconductor Corporation Document #: 38-05043 Rev. *B • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600 Revised July 24, 2006

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