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MT47H32M16HR-25E

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Preliminary‡ 512Mb: x4, x8, x16 DDR2 SDRAM Features DDR2 SDRAM MT47H128M4 – 32 Meg x 4 x 4 banks MT47H64M8 – 16 Meg x 8 x 4 banks MT47H32M16 – 8 Meg x 16 x 4 banks Options1 Features • • • • • • • • • • • • • • • • • • Configuration – 128 Meg x 4 (32 Meg x 4 x 4 banks) – 64 Meg x 8 (16 Meg x 8 x 4 banks) – 32 Meg x 16 (8 Meg x 16 x 4 banks) • FBGA package (Pb-free) – x16 – 84-ball FBGA (8mm x 12.5mm) Rev. G – 84-ball FBGA (8mm x 12.5mm) Rev. H • FBGA package (Pb-free) – x4, x8 – 60-ball FBGA (8mm x 10mm) Rev. G – 60-ball FBGA (8mm x 10mm) Rev. H • FBGA package (lead solder) – x16 – 84-ball FBGA (8mm x 12.5mm) Rev. G • FBGA package (lead solder) – x4, x8 – 60-ball FBGA (8mm x 10mm) Rev. G • Timing – cycle time – 1.875ns @ CL = 7 (DDR2-1066) – 2.5ns @ CL = 5 (DDR2-800) – 2.5ns @ CL = 6 (DDR2-800) – 3.0ns @ CL = 4 (DDR2-667) – 3.0ns @ CL = 5 (DDR2-667) – 3.75ns @ CL = 4 (DDR2-533) • Self refresh – Standard – Low-power • Operating temperature – Commercial (0°C ≤ T C ≤ +85°C)2 – Industrial (–40°C ≤ T C ≤ +95°C; –40°C ≤ T A ≤ +85°C) • Revision VDD = 1.8V ±0.1V, V DDQ = 1.8V ±0.1V JEDEC-standard 1.8V I/O (SSTL_18-compatible) Differential data strobe (DQS, DQS#) option 4n-bit prefetch architecture Duplicate output strobe (RDQS) option for x8 DLL to align DQ and DQS transitions with CK 4 internal banks for concurrent operation Programmable CAS latency (CL) Posted CAS additive latency (AL) WRITE latency = READ latency - 1 tCK Selectable burst lengths: 4 or 8 Adjustable data-output drive strength 64ms, 8192-cycle refresh On-die termination (ODT) Industrial temperature (IT) option RoHS-compliant Supports JEDEC clock jitter specification Notes: PDF: 09005aef85651470 512MbDDR2.pdf - Rev. U 02/14 EN 1 Marking 128M4 64M8 32M16 HR NF CF SH HW JN -187E -25E -25 -3E -3 -37E None L None IT :G/:H 1. Not all options listed can be combined to define an offered product. Use the Part Catalog Search on www.micron.com for product offerings and availability. 2. For Extended CT operating temperature see IDD Table 11 (page 30) Note 7. Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2004 Micron Technology, Inc. All rights reserved. ‡Products and specifications discussed herein are for evaluation and reference purposes only and are subject to change by Micron without notice. Products are only warranted by Micron to meet Micron’s production data sheet specifications.

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