GL4100
GL4100
Side View and Thin Flat Type
Infrared Emitting Diode
s Features
s Outline Dimensions
3.0
Detector center
2 - C0.5
1. Mouses
2. Track balls
0.7
Pale red transparent
epoxy resin
1.4
4.0
0.3MAX.
4˚
4˚
0.1MAX.
(1.7 )
2 - 0.45 + 0.3
- 0.1
2
1
0.5MIN.
Rugged resin 0.2 MAX.
2 - 4 + 0.3
- 0.1
1
(2.54 )
6˚
6˚
2.8
Symbol
IF
I FM
VR
P
Topr
Tstg
Tsol
* ( ) : Reference dimensions
* Tolerance : ± 0.2 mm
(Ta=25˚C)
Rating
50
1
6
75
- 25 to + 85
- 40 to + 85
260
Unit
mA
A
V
mW
˚C
˚C
˚C
1.4mm
Parameter
Forward current
*1
Peak forward current
Reverse voltage
Power dissipation
Operating temperatur
Storage temperature
*2
Soldering temperature
1 Anode
2 Cathode
6˚
6˚
s Absolute Maximum Ratings
2
4˚
0.15
4˚
1.4
s Applications
1.8
0.7
0.9MAX.
Rugged resin
Gate burr
(Half intensity angle : ± 90˚ )
(Unit : mm)
17.5 + 15
- 10
1. Compact flat package
2. Wide beam angle
Soldering area
* 1 Pulse width <=100µ s, Duty ratio=0.01
* 2 For 5 seconds at the position of 1.4 mm from the resin edge
“ In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that occur in equipment using any of SHARP's devices, shown in catalogs,
data books, etc. Contact SHARP in order to obtain the latest version of the device specification sheets before using any SHARP's device.”
