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SN74LVC2G126DCUT

製品説明
仕様・特性

SN74LVC2G126 DUAL BUS BUFFER GATE WITH 3-STATE OUTPUTS www.ti.com SCES205I – APRIL 1999 – REVISED JUNE 2006 FEATURES • • • • • • • • • Available in the Texas Instruments NanoStar™ and NanoFree™ Packages Supports 5-V VCC Operation Inputs Accept Voltages to 5.5 V Max tpd of 4 ns at 3.3 V Low Power Consumption, 10-µA Max ICC ±24-mA Output Drive at 3.3 V Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C Typical VOHV (Output VOH Undershoot) >2 V at VCC = 3.3 V, TA = 25°C • • DCT PACKAGE (TOP VIEW) Ioff Supports Partial-Power-Down Mode Operation Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101) YEA, YEP, YZA, OR YZP PACKAGE (BOTTOM VIEW) DCU PACKAGE (TOP VIEW) 1OE 1 8 VCC 1A 2 7 2OE 2Y 3 6 1Y GND 4 5 1OE 1A 2Y GND 1 8 2 7 3 6 4 5 VCC 2OE 1Y 2A GND 2Y 1A 1OE 4 5 3 6 2 7 1 8 2A 1Y 2OE VCC 2A See mechanical drawings for dimensions. DESCRIPTION/ORDERING INFORMATION This dual bus buffer gate is designed for 1.65-V to 5.5-V VCC operation. NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. ORDERING INFORMATION PACKAGE (1) TA ORDERABLE PART NUMBER NanoStar™ – WCSP (DSBGA) 0.17-mm Small Bump – YEA NanoFree™ – WCSP (DSBGA) 0.17-mm Small Bump – YZA (Pb-free) –40°C to 85°C NanoStar™ – WCSP (DSBGA) 0.23-mm Large Bump – YEP SN74LVC2G126YEAR SN74LVC2G126YZAR Reel of 3000 VSSOP – DCU (1) (2) _ _ _CN_ SN74LVC2G126YEPR NanoFree™ – WCSP (DSBGA) 0.23-mm Large Bump – YZP (Pb-free) SSOP – DCT TOP-SIDE MARKING (2) SN74LVC2G126YZPR Reel of 3000 SN74LVC2G126DCTR Reel of 3000 SN74LVC2G126DCUR Reel of 250 SN74LVC2G126DCUT C26_ _ _ C26_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site. DCU: The actual top-side marking has one additional character that designates the assembly/test site. YEA/YZA,YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoStar, NanoFree are trademarks of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1999–2006, Texas Instruments Incorporated

ブランド

TI

会社名

Texas Instruments Incorporated

本社国名

U.S.A

事業概要

世界25ヶ国以上に製造・販売拠点を有する国際的な半導体企業であり、デジタル情報家電、ワイヤレス、ブロードバンド市場に欠かせないデジタル信号処理を行うDSPと、それに関連するアナログIC、マイクロコントローラを主力製品としている。

供給状況

 
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