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RK73B2ATDRK73K2ATD
RESISTORS TECHNOLOGY OF TOMORROW FLAT CHIP THICK FILM (5% • 2%) GENERAL PURPOSE RK73B STRUCTURE 1 2 3 4 5 6 7 8 9 10 Ceramic substrate Top termination (Ag Pd) Bottom termination (Ag Pd) Resistive layer Glass layer Trimming cut Protective layer End termination Diffusion barrier (Ni) Solder plating ~ 11 ~ 11 ~ 11 ~ 11 µm µm µm µm ~ 25 µm ~ 0.05 µm ~ 8 µm ~ 8 µm IDENTIFICATION TYPE COATING COLOR MARKING RK73 1E and RK73 1H RK73 1J ... RK73 3A Black None White, 3 digits TYPE DESIGNATION (HOW TO ORDER) Old Part No. RK73K 1J New Part No. RK73B 1J PRODUCT CODE STYLE G TD TD 103 G TERMINATION SURFACE MATERIAL TOLERANCE 10K L TAPING* NOMINAL RESISTANCE TOLERANCE T: Sn L: Sn/Pb FEATURES 3 digits *Please see “PACKAGING” DIMENSIONS (mm) s RuO2 thick film resistor element s Anti-leaching nickel barrier terminations s Excellent heat resistance and moisture resistance are ensured by the use of metal glaze thick film s Rated ambient temperature: +70° C s Taping according to IEC-60 286-3 s Meets or exceeds IEC 60 115, CECC 40 401-802 s Suitable for reflow and wave soldering s Lab Kit available SIZE 0201 0402 0603 0805 1206 1210 2010 2512 TYPE RK73 RK73 RK73 RK73 RK73 RK73 RK73 RK73 L 1H 1E 1J 2A 2B 2E 2H 3A 0.6 ± 0.03 1.0 + 0.1 – 0.05 1.6 ± 0.2 2.0 ± 0.2 3.2 ± 0.2 5.0 ± 0.2 6.3 ± 0.2 W 0.3 ± 0.5 ± 0.8 ± 1.25 ± 1.6 ± 2.6 ± 2.5 ± 3.1 ± c 0.03 0.05 0.1 0.1 0.2 0.2 0.2 0.2 0.1 0.2 0.3 0.4 ± ± ± ± d 0.05 0.1 0.1 0.2 0.5 ± 0.3 t 0.15 ± 0.05 0.25 + 0.05 – 0.1 0.3 ± 0.1 0.3 + 0.2 – 0.1 0.4 + 0.2 – 0.1 0.23 0.35 0.45 0.5 ± 0.03 ± 0.05 ± 0.1 ± 0.1 0.6 ± 0.1 RATING SIZE TYPE NEW 0201 RK73B 1H 0402 RK73B 1E 0603 0805 1206 RK73B 1J RK73B 2A RK73B 2B 1210 RK73B 2E 2010 RK73B 2H 2512 RK73B 3A T.C.R. (ppm/K) ± 400 ± 200 ± 400 ± 200 ± 400 ± 200 ± 400 ± 200 ± 400 ± 200 ± 400 ± 200 ± 400 ± 200 ± 400 ± 200 POWER RATING 0.05 W MAX. WORKING VOLTAGE 25 V MAX. OVERLOAD VOLTAGE 50 V 100 V 0.1 W 0.125 W J(± 5%) 10 Ω … 1 MΩ 1 Ω . . . 9.1 Ω 1 Ω . . . 9.1 Ω 11 MΩ . . . 22 MΩ 10 Ω… 10 MΩ 1 Ω . . . 9.1 Ω 1.1 MΩ . . . 10 MΩ 1 Ω . . . 9.1 Ω 1.1 MΩ . . . 10 MΩ 10 Ω … 1 MΩ 200 V 10 Ω … 1 MΩ 10 Ω … 5.6 MΩ 1 Ω . . . 9.1 Ω 6.2 MΩ . . . 22 MΩ 200 V 10 Ω . . . 1 kΩ 1.1 kΩ . . . 5.6 MΩ 400 V — 10 Ω … 5.6 MΩ — 10 Ω … 5.6 MΩ 0.75 W 1W * Please note derating diagram 6 - 55° C … + 125° C* 10 Ω … 10 MΩ 10 Ω … 5.6 MΩ — 150 V OPERATING TEMPERATURE RANGE 1 Ω . . . 9.1 Ω 1.1 MΩ . . . 4.7 MΩ 10 Ω … 10 MΩ 0.25 W 0.5 W 0.33 W 0.5 W 0.33 W G (± 2%) – 10 Ω … 1 MΩ – 10 Ω … 10 MΩ 1 Ω . . . 9.1 Ω 0.063 W 50 V RESISTANCE RANGE (E24) - 55° C . . . +155° C* 1 Ω . . . 9.1 Ω 6.2 MΩ . . . 22 MΩ 1 Ω . . . 9.1 Ω 6.2 MΩ . . . 10 MΩ 10 Ω . . . 1 kΩ 1.1 kΩ . . . 5.6 MΩ 1 Ω . . . 9.1 Ω 6.2 MΩ . . . 22 MΩ 10 Ω … 5.6 MΩ 1 Ω . . . 9.1 Ω 6.2 MΩ . . . 22 MΩ 10 Ω … 5.6 MΩ - 55° C . . . +125° C* RESISTORS TECHNOLOGY OF TOMORROW RECOMMENDED PAD DIMENSIONS FOR REFLOW SOLDERING DIMENSIONS (mm) TYPE RK73 SG73 RN73 SR73 RK73N LT73 NT73 PT72 LA73 CR73 RF73 KL73 STYLE COMPONENT SIZE A B C D 1H 0.6 x 0.3 0.25 0.7 0.3 0.225 1E 1.0 x 0.5 0.5 1.3 0.3 0.4 1J 1.6 x 0.8 1.0 2.0 0.6 0.5 2A 2.0 x 1.25 1.3 2.5 1.05 0.6 2B 3.2 x 1.6 2.2 4.0 1.4 0.9 2E 3.2 x 2.5 2.2 4.0 2.3 0.9 2H 5.0 x 2.5 3.5 6.3 2.3 1.4 3A 6.4 x 3.2 4.6 8.0 3.0 1.7 SOLDERING PAD FOR WAVE SOLDERING CHIP COMPONENT DIMENSIONS (mm) TYPE RK73 SG73 RN73 SR73 RK73N LT73 NT73 LA73 CR73 RF73 KL73 STYLE COMPONENT SIZE A B C D 1E 1.0 x 0.5 0.5 1.5 0.5 0.5 1J 1.6 x 0.8 1.0 2.4 0.8 0.7 2A 2.0 x 1.25 1.3 3.1 1.25 0.9 2B 3.2 x 1.6 2.2 4.4 1.6 1.1 2E 3.2 x 2.5 2.2 4.4 2.5 1.1 2H 5.0 x 2.5 3.5 6.3 2.5 1.4 3A 6.4 x 3.2 4.6 8.0 3.2 1.7 RECOMMENDED IR PROFILE (FLAT TYPE COMPONENTS) p. Max. Temp. Te m Temp. (°C) 240 Reflow Zone Na Ri si ng 215 a tur lC Pre-Cure li oo 150 mm Ris ing eco Tem p . R ng de en SnPb Terminations 30 30 d Room Temp. 20 30 Time (sec.) RECOMMENDED WAVE SOLDER PROFILE (FLAT TYPE COMPONENTS) Temp (°C) 10 to 30 sec. 3 to 30 sec. 260 183 Natural Cooling to Ambient Pre-Heat Zone 75°C/sec. (typ.) 160 140 3°C/sec. (max.) 25 SnPb Terminations Time (sec.) 9
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