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MMSZ16T1G

製品説明
仕様・特性

MMSZxxxT1G Series, SZMMSZxxxT1G Series Zener Voltage Regulators 500 mW SOD−123 Surface Mount Three complete series of Zener diodes are offered in the convenient, surface mount plastic SOD−123 package. These devices provide a convenient alternative to the leadless 34−package style. http://onsemi.com Features         500 mW Rating on FR−4 or FR−5 Board Wide Zener Reverse Voltage Range − 2.4 V to 56 V Package Designed for Optimal Automated Board Assembly Small Package Size for High Density Applications ESD Rating of Class 3 (> 16 kV) per Human Body Model AEC−Q101 Qualified and PPAP Capable SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements Pb−Free Packages are Available* SOD−123 CASE 425 STYLE 1 1 Cathode 2 Anode MARKING DIAGRAM Mechanical Characteristics CASE: Void-free, transfer-molded, thermosetting plastic case FINISH: Corrosion resistant finish, easily Solderable MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 1 xx M G G 260C for 10 Seconds POLARITY: Cathode indicated by polarity band FLAMMABILITY RATING: UL 94 V−0 xx M G MAXIMUM RATINGS Rating Total Power Dissipation on FR−5 Board, (Note 1) @ TL = 75C Derated above 75C = Device Code = Date Code = Pb−Free Package (Note: Microdot may be in either location) Symbol PD Max Unit 500 6.7 mW mW/C ORDERING INFORMATION Device Package Shipping† Thermal Resistance, Junction−to−Ambient (Note 2) RqJA 340 C/W MMSZxxxT1G SOD−123 (Pb−Free) 3,000 / Tape & Reel Thermal Resistance, Junction−to−Lead (Note 2) RqJL 150 C/W SZMMSZxxxT1G SOD−123 (Pb−Free) 3,000 / Tape & Reel TJ, Tstg −55 to +150 C MMSZxxxT3G SOD−123 (Pb−Free) 10,000 / Tape & Reel SZMMSZxxxT3G SOD−123 (Pb−Free) 10,000 / Tape & Reel Junction and Storage Temperature Range Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. FR−5 = 3.5 X 1.5 inches. 2. Thermal Resistance measurement obtained via infrared Scan Method. †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. DEVICE MARKING INFORMATION *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.  Semiconductor Components Industries, LLC, 2012 January, 2012 − Rev. 11 1 See specific marking information in the device marking column of the Electrical Characteristics table on page 2 of this data sheet. Publication Order Number: MMSZ2V4T1/D

ブランド

ONS

会社名

ON Semiconductor

本社国名

U.S.A

事業概要

自動車、通信、コンピュータ、コンシューマ、工業、LED照明、医療、軍事/航空および電源アプリケーション向けの電源および信号管理、ロジック、ディスクリートおよびカスタム・デバイスを含む半導体のサプライヤー。

供給状況

 
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