PulseGuard® Suppressors
Surface Mount Polymeric ESD Suppressors
Reference Dimensions:
Sn
1.60 (.063")
0.076 (.003") MIN
PGB1 Series Lead-Free
1.04
(.041") REF
0.787 (.031")
Description
0.254 (.010") MIN
0.356 (.014")
Reference Dimensions:
Wave
Solder
Reflow
Solder
2.24 (.088")
0.508 Reflow
(.020")
0.762 (.030")
Solder
Sn
1.01 (.040")
1.01 (.040")*
1.27
(.050")
3.05 (1.20")
2.29
(.090")
PulseGuard ESD Suppressors help protect sensitive
electronic equipment against electrostatic discharge (ESD).
They supplement the on-chip protection of integrated
circuitry and are best suited for low-voltage, high-speed
applications where low capacitance is important. Data
ports utilizing such high-speed protocols as USB 2.0,
IEEE1394, HDMI and DVI can benefit from this new
technology.
3.30 (1.30")
1.01 (.040")
1.27 (.050")
2.032
(.080")
1.01 (.040")
1.27
(.050")
2.997
(.118")
1.27 (.050")
0.635
2.032 (.080")*
Equivalent Circuit
(.025")
0.762 (.030")
0.51
(.020")
0.762 (.030")
0.076
(.003") MIN (TYP)
0402 and 0603 Devices
Equivalent Circuit
Note: For wave solder, increase the spacing
in both the horizontal and vertical
Reference Dimensions: dimensions by
0.254 (.010") where denoted by an asterisk (*)
0.762
(.030")
20.81
1
Reflow Solder
(.032") REF
2.03 (.080") TYP
0.71 (.028")
1.27
(.050")
0.74
SOT23 Device
(.029")
Equivalent Circuit
1.27
(.050") TYP
3
0.203
(.008") TYP
0.51 (.020")
0.635 (.025")
0.127
(.005") TYP
0.279
(.011")
0.74
(.029")
PulseGuard suppressors use polymer composite materials
to suppress fast-rising ESD transients (as specified in IEC
61000-4-2 and MIL-STD-883C), while adding virtually no
capacitance to the circuit.
Features
•R
oHS compliant and
lead-free
• Ultra-low capacitance
• Low leakage current
• Fast response time
• Bi-directional
• ithstands multiple
W
ESD strikes
• tandard EIA SOCM-1608
S
package
• ompatible with
C
pick-and-place processes
• vailable in 1000, 3000,
A
5000 and 10000 piece
reels (EIA-RS481)
Sn
Applications
NOTE: When wave soldering, the gap between pads should be
covered with photo-imageable solder mask to prevent bridging
between terminations under the component. Also the spacing
between the ground contacts should be increased from
.635mm (.025") to .889 (.035").
1
2
• HDTV Hardware
• aptop/Desktop
L
0.406 (.016") TYP
Computers
• Network Hardware
0805 Device
Equivalent Circuit
1
2
• Computer Peripherals
• Digital Cameras
• External Storage
• Set-Top Boxes
6
5
4
3
Product Characteristics
Part Number
Lines Protected
Component
Package
PGB1010402
1
0402
PGB1010603
1
0603
PGB102ST23
2
SOT23
PGB1040805
4
0805
PGB1 Series
Specifications are subject to change without notice.
Electronics Designers Guide
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©2007 Littelfuse
