256Mb: x16, x32 Mobile LPDDR SDRAM
Features
Mobile Low-Power DDR SDRAM
MT46H16M16LF – 4 Meg x 16 x 4 Banks
MT46H8M32LF – 2 Meg x 32 x 4 Banks
Features
Marking
Options
• VDD/VDDQ
– 1.8V/1.8V
• Configuration
– 16 Meg x 16 (4 Meg x 16 x 4
banks)
– 8 Meg x 32 (2 Meg x 32 x 4
banks)
• Row-size option
– JEDEC-standard option
– Reduced page-size option2
• Plastic "green" package
– 60-ball VFBGA (8mm x 9mm) 1
– 90-ball VFBGA (8mm x 13mm) 2
• Timing – cycle time
– 5ns @ CL = 3 (200 MHz)
– 5.4ns @ CL = 3 (185 MHz)
– 6ns @ CL = 3 (166 MHz)
– 7.5ns @ CL = 3 (133 MHz)
• Operating temperature range
– Commercial (0˚ to +70˚C)
– Industrial (–40˚C to +85˚C)
• Design revision
• VDD/VDDQ = 1.70–1.95V
• Bidirectional data strobe per byte of data (DQS)
• Internal, pipelined double data rate (DDR) architecture; two data accesses per clock cycle
• Differential clock inputs (CK and CK#)
• Commands entered on each positive CK edge
• DQS edge-aligned with data for READs; centeraligned with data for WRITEs
• 4 internal banks for concurrent operation
• Data masks (DM) for masking write data—one mask
per byte
• Programmable burst lengths (BL): 2, 4, 8, or 16
• Concurrent auto precharge option is supported
• Auto refresh and self refresh modes
• 1.8V LVCMOS-compatible inputs
• On-chip temp sensor to control self refresh rate
• Partial-array self refresh (PASR)
• Deep power-down (DPD)
• Status read register (SRR)
• Selectable output drive strength (DS)
• Clock stop capability
• 64ms refresh
Notes:
H
16M16
8M32
LF
LG
BF
B5
-5
-54
-6
-75
None
IT
:H
1. Only available for x16 configuration.
2. Only available for x32 configuration.
Table 1: Configuration Addressing
Architecture 16 Meg x 16 8 Meg x 32
Reduced
Page-Size
Option2
Configuration 4 Meg x 16 x 2 Meg x 32 x
4 banks
4 banks
2 Meg x 32
x 4 banks
Refresh count
8K
8K A[12:0]
4K A[11:0]
8K A[12:0]
Column
addressing
1
4K
Row
addressing
PDF: 09005aef834bf85b
256mb_mobile_ddr_sdram_t36n.pdf - Rev. I 09/10 EN
8K
512 A[8:0]
512 A[8:0]
256 A[7:0]
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2008 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.
