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部品型式

MT29F8G08ADADAH4

製品説明
仕様・特性

Micron Confidential and Proprietary 4Gb, 8Gb, 16Gb: x8, x16 NAND Flash Memory Features NAND Flash Memory MT29F4G08ABADAH4, MT29F4G08ABADAWP, MT29F4G08ABBDAH4, MT29F4G08ABBDAHC, MT29F4G16ABADAH4, MT29F4G16ABADAWP, MT29F4G16ABBDAH4, MT29F4G16ABBDAHC, MT29F8G08ADADAH4, MT29F8G08ADBDAH4, MT29F8G16ADADAH4, MT29F8G16ADBDAH4, MT29F16G08AJADAWP Features • First block (block address 00h) is valid when shipped from factory with ECC. For minimum required ECC, see Error Management. • Block 0 requires 1-bit ECC if PROGRAM/ERASE cycles are less than 1000 • RESET (FFh) required as first command after power-on • Alternate method of device initialization (Nand_Init) after power up (contact factory) • Internal data move operations supported within the plane from which data is read • Quality and reliability – Data retention: 10 years – Endurance: 100,000 PROGRAM/ERASE cycles • Operating voltage range – VCC: 2.7–3.6V – VCC: 1.7–1.95V • Operating temperature: – Commercial: 0°C to +70°C – Industrial (IT): –40°C to +85°C – Automotive Industrial (AIT): –40°C to +85°C – Automotive (AAT): –40°C to +105°C • Package – 48-pin TSOP type 1, CPL 2 – 63-ball VFBGA • Open NAND Flash Interface (ONFI) 1.0-compliant1 • Single-level cell (SLC) technology • Organization – Page size x8: 2112 bytes (2048 + 64 bytes) – Page size x16: 1056 words (1024 + 32 words) – Block size: 64 pages (128K + 4K bytes) – Plane size: 2 planes x 2048 blocks per plane – Device size: 4Gb: 4096 blocks; 8Gb: 8192 blocks 16Gb: 16,384 blocks • Asynchronous I/O performance – tRC/tWC: 20ns (3.3V), 25ns (1.8V) • Array performance – Read page: 25µs 3 – Program page: 200µs (TYP: 1.8V, 3.3V)3 – Erase block: 700µs (TYP) • Command set: ONFI NAND Flash Protocol • Advanced command set – Program page cache mode4 – Read page cache mode 4 – One-time programmable (OTP) mode – Two-plane commands 4 – Interleaved die (LUN) operations – Read unique ID – Block lock (1.8V only) – Internal data move • Operation status byte provides software method for detecting – Operation completion – Pass/fail condition – Write-protect status • Ready/Busy# (R/B#) signal provides a hardware method of detecting operation completion • WP# signal: Write protect entire device PDF: 09005aef83b25735 m60a_4gb_8gb_16gb_ecc_nand.pdf - Rev. Q 04/14 EN Notes: 1 1. The ONFI 1.0 specification is available at www.onfi.org. 2. CPL = Center parting line. 3. See Program and Erase Characteristics for tR_ECC and tPROG_ECC specifications. 4. These commands supported only with ECC disabled. Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2009 Micron Technology, Inc. All rights reserved. Products and specifications discussed herein are subject to change by Micron without notice.

ブランド

MICRON

会社名

Micron Technology

本社国名

U.S.A

事業概要

メモリ・ストレージ用の各種半導体メモリ(DRAMやフラッシュメモリとそれらの搭載製品群)を製造・販売している。主力製品は、DRAM, FLASH MEMORY

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