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MBRS240LT3G

製品説明
仕様・特性

MBRS240LT3G, NRVBS240LT3G Surface Mount Schottky Power Rectifier SMB Power Surface Mount Package www.onsemi.com These devices employ the Schottky Barrier principle in a metal−to−silicon power rectifier. Features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency switching power supplies; free wheeling diodes and polarity protection diodes. SCHOTTKY BARRIER RECTIFIER 2.0 AMPERES, 40 VOLTS Features • • • • • • • Compact Package with J−Bend Leads Ideal for Automated Handling Highly Stable Oxide Passivated Junction Guard−Ring for Overvoltage Protection Low Forward Voltage Drop ESD Ratings: ♦ Human Body Model = 3B (> 16000 V) ♦ Machine Model = C (> 400 V) NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable* These are Pb−Free Devices Mechanical Characteristics • • • • • • Case: Molded Epoxy Epoxy Meets UL 94 V−0 @ 0.125 in Weight: 95 mg (Approximately) Cathode Polarity Band Maximum Temperature of 260°C/10 Seconds for Soldering Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable SMB CASE 403A MARKING DIAGRAM AYWW 2BL4G G 2BL4 A Y WW G = Specific Device Code = Assembly Location** = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) **The Assembly Location code (A) is front side optional. In cases where the Assembly Location is stamped in the package bottom (molding ejecter pin), the front side assembly code may be blank. ORDERING INFORMATION Package Shipping† MBRS240LT3G SMB (Pb−Free) 2,500 / Tape & Reel NRVBS240LT3G* SMB (Pb−Free) 2,500 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2013 June, 2017 − Rev. 8 1 Publication Order Number: MBRS240LT3/D

ブランド

ONS

会社名

ON Semiconductor

本社国名

U.S.A

事業概要

自動車、通信、コンピュータ、コンシューマ、工業、LED照明、医療、軍事/航空および電源アプリケーション向けの電源および信号管理、ロジック、ディスクリートおよびカスタム・デバイスを含む半導体のサプライヤー。

供給状況

 
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