F-217
MLE–120–01–G–DV
MLE–150–01–G–DV
10 YEAR MFG
WITH 30 µ" GOLD
EXTENDED LIFE
PRODUCT
CLM–126–02–F–D
CLM–111–02–L–D
HIGH MATING
CYCLES
(1.00 mm) .0394"
CLM, MLE SERIES
RUGGED RELIABLE MICRO SOCKETS
SPECIFICATIONS
For complete specifications and
recommended PCB layouts
see www.samtec.com?CLM
or www.samtec.com?MLE
Insulator Material:
Black LCP
Contact Material:
CLM: Phosphor Bronze
MLE: BeCu
Plating:
CLM: Au or Sn
over 50 µ" (1.27 µm) Ni
MLE: Au over 10 µ"
(0.25 µm) Ni
Current Rating (CLM/FTM):
2.8 A per pin
(1 pin powered per row)
Current Rating (MLE/FTM):
2.9 A per pin
(1 pin powered per row)
Operating Temp Range:
-55 °C to +125 °C
Contact Resistance:
CLM: 15 mW
Max Cycles:
CLM: 100 with 10 µ" (0.25 µm) Au
Voltage Rating:
MLE: 310 VAC
Insertion Depth:
CLM: Top Entry = (1.40 mm)
.055" min., Bottom Entry =
(2.41 mm) .095" min.
(Add board thickness for
correct post OAL)
MLE: (1.63 mm) .064" to
(3.18 mm) .125" with
(0.38 mm) .015" wipe,
pass-through, or
(2.44 mm) .096" minimum
for bottom entry
Normal Force:
CLM: 40 grams (0.39 N) average
RoHS Compliant:
Yes
Lead-Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (02-25)
(0.15 mm) .006" max (26-50)
RECOGNITIONS
CLM
NO. PINS
PER ROW
1
PLATING
OPTION
02
Mates with:
FTM, FTMH, MW
–F
= Bottom Entry
(Required for bottom entry)
–L
(1.00)
.03937
No. of positions x (1.00) .03937
+ (0.318) .0125
100
02
–P
= Pick & Place Pad
(7 positions minimum)
–P
01
(0.28)
.011
(2.26)
.089
(2.12)
.084
PIN/ROW
04-15
16-50
–PA
(8.26) .325
by A
(3.81)
.150
APPLICATION
= (3.50 mm) .138" DIA
Polyimide film Pick & Place Pad
(7 positions minimum)
(2.41)
.095
(2.54)
.100
(1.00)
.03937
–K
= 10 µ" (0.25 µm)
Gold on contact,
Matte Tin on tail
(5.72)
.225
x
(3.57)
.140
A
(1.36)
.054
(0.89) .035
DIA
(7.00)
.275
ALSO AVAILABLE
(MOQ Required)
• Alignment pin
• Other Gold plating options
Contact Samtec.
1
NO. PINS
PER ROW
01
(0.64)
.025
DIA
(0.30)
.012
01
(4.32)
.170
= Alignment Pin
(3 positions minimum)
Metal or plastic at Samtec
discretion
–K
= (4.00 mm) .1575" DIA
Polyimide film Pick & Place Pad
(5 positions minimum)
–A
–P
(6.35)
.250
x
(3.18)
.125
(3.30)
.130
OPTIONS
–A
(0.71)
.028
02
(3.07)
.121
(3.12)
.123
DV
–G
No. of positions
x (1.00) .03937 + (0.20) .008
(1.00)
.03937
PLATING
OPTION
= 10 µ"
(0.25 µm)
Gold
02 thru 50
(1.00) 100
.03937
–TR
= Tape & Reel Packaging
–PA
(3.56)
.140
(7.11)
.280
Mates with:
FTM, FTMH, MW
FILE NO. E111594
= Pick & Place Pad with
integral Alignment Pin
(3.00)
.118
Pass-Thru
MLE
OPTIONS
–BE
= Gold flash on
contact,
Matte Tin on tail
02 thru 50
For complete scope of
recognitions see
www.samtec.com/quality
Note: Some lengths, styles
and options are non-standard,
non-returnable.
D
= Metal Pick & Place Pad
(5 positions minimum)
(3.50)
.138
–P
WWW.SAMTEC.COM
Due to technical progress, all designs, specifications and components are subject to change without notice.
–TR
= Tape & Reel Packaging
