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TPS842AF
TPS842A(F),TPS844(F) TOSHIBA Photo-IC Silicon Epitaxial Planar TPS842A(F),TPS844(F) Photoelectric Switches Copiers, Printers, and Facsimiles Vending Machines Handy Terminals Unit: mm The TPS842A(F) and TPS844(F) represent a Si photo IC of digital output type that integrates a photodiode, amplifier circuit, and Schmitt trigger circuit into a single chip. These devices are low voltage drive types, and they allow construction of low voltage systems which thus consume less power. These devices respond faster than the phototransistor type. They output a low when light is input. • • • • • • Compact side-view epoxy resin package Operates over a wide supply voltage range : VCC = 2.7 to 15 V High speed response : tpLH = 15 μs, tpHL = 9 μs (max) High sensitivity: 0.3 mW/cm2 (max) Can be directly connected to TTL and CMOS. Digital output: TPS842A(F) …. open collector TPS844(F) …. with a pull-up resistor TOSHIBA 0-3H1 Weight: 0.12 g (typ.) Absolute Maximum Ratings (Ta = 25°C) Characteristics Symbol Supply voltage Output voltage VCC TPS842A(F) TPS844(F) Output current Unit 15 V 15 =VCC V IO Storage temperature range (Note 1) −0.213 mA/°C 250 mW −3.33 mW/°C −30 to 95 °C Tstg Operating temperature range ΔIO/°C Topr Power dissipation derating (Ta > 25°C) mA ΔP/°C Power dissipation 16 P Output current derating (Ta > 25°C) Soldering temperature (5s) VO Rating −40 to 100 °C Tsol 260 °C Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings and the operating ranges. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: At the location of 1.3 mm from the resin package bottom. 1 2007-10-01
TOSHIBA
株式会社 東芝セミコンダクター＆ストレージ社
日本
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