DATA SHEET
256M bits SDRAM
WTR (Wide Temperature Range)
EDS2516APTA-TI-E (16M words × 16 bits)
Specifications
Pin Configurations
• Density: 256M bits
• Organization
⎯ 4M words × 16 bits × 4 banks
• Package: 54-pin plastic TSOP (II)
⎯ Lead-free (RoHS compliant)
• Power supply: VDD, VDDQ = 3.3V ± 0.3V
• Clock frequency: 133MHz (max.)
• Four internal banks for concurrent operation
• Interface: LVTTL
• Burst lengths (BL): 1, 2, 4, 8, full page
• Burst type (BT):
⎯ Sequential (1, 2, 4, 8, full page)
⎯ Interleave (1, 2, 4, 8)
• /CAS Latency (CL): 2, 3
• Precharge: auto precharge operation for each burst
access
• Refresh: auto-refresh, self-refresh
• Refresh cycles: 8192 cycles/64ms
⎯ Average refresh period: 7.8μs
• Operating ambient temperature range
⎯ TA = −40°C to +85°C
/xxx indicates active low signal.
54-pin plastic TSOP (II)
EO
VDD
DQ0
VDDQ
DQ1
DQ2
VSSQ
DQ3
DQ4
VDDQ
DQ5
DQ6
VSSQ
L
Pr
Features
DQ7
VDD
LDQM
/WE
/CAS
/RAS
/CS
BA0
BA1
A10
A0
A1
A2
A3
VDD
VSSQ
DQ14
DQ13
VDDQ
DQ12
DQ11
VSSQ
DQ10
DQ9
VDDQ
DQ8
VSS
NC
UDQM
CLK
CKE
A12
A11
A9
A8
A7
A6
A5
A4
VSS
(Top view)
Address input
Bank select address
DQ0 to DQ15 Data-input/output
Chip select
/CS
Row address strobe
/RAS
/CAS
Column address strobe
/WE
Write enable
A0 to A12,
BA0, BA1
VSS
DQ15
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
UDQM,LDQM Input/output mask
Clock enable
Clock input
CKE
CLK
VDD
VSS
Power for internal circuit
Ground for internal circuit
od
• Single pulsed /RAS
• Burst read/write operation and burst read/single write
operation capability
• Byte control by UDQM and LDQM
• Wide temperature range
⎯ TA = −40°C to +85°C
Power for DQ circuit
Ground for DQ circuit
No connection
VDDQ
VSSQ
NC
t
uc
Document No. E0677E20 (Ver. 2.0)
Date Published December 2005 (K) Japan
Printed in Japan
URL: http://www.elpida.com
This product became EOL in April, 2007.
©Elpida Memory, Inc. 2005
