Si7540DP
Vishay Siliconix
N- and P-Channel 12-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
N-Channel
RDS(on) (Ω)
0.017 at VGS = 4.5 V
12
P-Channel
11.8
0.025 at VGS = 2.5 V
9.8
0.032 at VGS = - 4.5 V
- 8.9
0.053 at VGS = - 2.5 V
- 12
• Halogen-free According to IEC 61249-2-21
Available
• TrenchFET® Power MOSFETs
• New Low Thermal Resistance PowerPAK®
Package with Low 1.07 mm Profile
• PWM Optimized for High Efficiency
• 100 % Rg Tested
ID (A)
- 6.9
APPLICATIONS
PowerPAK SO-8
S1
6.15 mm
• Point-of-Load Synchronous Rectifier
- 5 V or 3.3 V BUS Step Down
- Qg Optimized for 500 kHz Operation
• Synchronous Buck, Shoot-Thru Resistant
5.15 mm
1
G1
2
S2
D1
3
S2
G2
4
D1
8
D1
G2
7
D2
6
G1
D2
5
Bottom View
Ordering Information: Si7540DP-T1-E3 (Lead (Pb)-free)
Si7540DP-T1-GE3 (Lead (Pb)-free and Halogen-free)
S1
N-Channel MOSFET
D2
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter
Symbol
VDS
VGS
Drain-Source Voltage
Gate-Source Voltage
TA = 25 °C
TA = 70 °C
Continuous Drain Current (TJ = 150 °C)a
IDM
IS
Pulsed Drain Current
a
Continuous Source Current (Diode Conduction)
TA = 25 °C
Maximum Power Dissipationa
TA = 70 °C
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
ID
PD
TJ, Tstg
b,c
N-Channel
Steady
10 s
12
P-Channel
Steady
10 s
- 12
±8
11.8
9.5
7.6
6.1
- 8.9
- 7.1
- 5.7
- 4.6
1.1
- 2.9
1.4
3.5
0.9
2.2
- 55 to 150
260
- 1.1
1.4
0.9
20
2.9
3.5
2.2
Unit
V
A
W
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambienta
Maximum Junction-to-Case (Drain)
Symbol
t ≤ 10 s
Steady State
Steady State
RthJA
RthJC
N-Channel
Typical
Maximum
26
35
60
85
3.9
5.5
P-Channel
Typical
Maximum
26
35
60
85
3.9
5.5
Unit
°C/W
Notes:
a. Surface Mounted on 1" x 1" FR4 board.
b. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
Document Number: 71911
S09-0227-Rev. F, 09-Feb-09
www.vishay.com
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