4GB, 8GB, 16GB, 32GB: e·MMC
Features
e·MMC™ Memory
MTFC4GGQDM, MTFC4GGQDI, MTFC8GKQDI,
MTFC16GKQDI, MTFC32GKQDH
Features
Figure 1: Micron e·MMC Device
• MultiMediaCard (MMC) controller and NAND Flash
• 153-ball FBGA or 169-ball FBGA (6/6 RoHS-compliant)
• VCC: 2.7–3.6V
• VCCQ (dual voltage): 1.65–1.95V, 2.7–3.6V
• Storage temperature range: –40˚C to +85˚C
• Typical current consumption
– Standby current: 70µA (4GB, 8GB); 90µA (16GB);
130µA (32GB)
– Active current (RMS): 70mA (4GB, 8GB); 90mA
(16GB, 32GB)
MMC
power
MMC controller
NAND Flash
power
MMC
interface
NAND Flash
MMC-Specific Features
Options
• JEDEC/MMC standard version 4.41-compliant
(JEDEC Standard No. 84-A441) – SPI mode, highpriority interrupt (HPI), background operation,
enhanced reliable WRITE, and double data rate
(DDR) function not supported
– Advanced 11-signal interface
– x1, x4, and x8 I/Os, selectable by host
– MMC mode operation
– Command classes: class 0 (basic); class 2 (block
read); class 4 (block write); class 5 (erase);
class 6 (write protection); class 7 (lock card)
– MMCplus™ and MMCmobile™ protocols
– Temporary write protection
– 52 MHz clock speed (MAX)
– Boot operation (high-speed boot)
– Sleep mode
– Reliable WRITE
– Replay-protected memory block (RPMB)
– Secure erase and trim
– Hardware reset signal
– Multiple partitions with enhanced attribute
– Permanent and power-on write protection
– Backward-compatible with previous MMC modes
• ECC and block management implemented
• Deviations from the JEDEC specification are described in the last section of this data sheet.
PDF: 09005aef838eabba
emmc_rev_q_v4_41_153b_169b_j534q567r.pdf - Rev. C 7/10 EN
• Density: 4GB, 8GB, 16GB, 32GB
• Temperature range
– Industrial temperature: –40˚C to +85˚C
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Products and specifications discussed herein are subject to change by Micron without notice.