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MTFC4GDKDI-WT

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4GB, 8GB, 16GB, 32GB: e·MMC Features e·MMC™ Memory MTFC4GGQDM, MTFC4GGQDI, MTFC8GKQDI, MTFC16GKQDI, MTFC32GKQDH Features Figure 1: Micron e·MMC Device • MultiMediaCard (MMC) controller and NAND Flash • 153-ball FBGA or 169-ball FBGA (6/6 RoHS-compliant) • VCC: 2.7–3.6V • VCCQ (dual voltage): 1.65–1.95V, 2.7–3.6V • Storage temperature range: –40˚C to +85˚C • Typical current consumption – Standby current: 70µA (4GB, 8GB); 90µA (16GB); 130µA (32GB) – Active current (RMS): 70mA (4GB, 8GB); 90mA (16GB, 32GB) MMC power MMC controller NAND Flash power MMC interface NAND Flash MMC-Specific Features Options • JEDEC/MMC standard version 4.41-compliant (JEDEC Standard No. 84-A441) – SPI mode, highpriority interrupt (HPI), background operation, enhanced reliable WRITE, and double data rate (DDR) function not supported – Advanced 11-signal interface – x1, x4, and x8 I/Os, selectable by host – MMC mode operation – Command classes: class 0 (basic); class 2 (block read); class 4 (block write); class 5 (erase); class 6 (write protection); class 7 (lock card) – MMCplus™ and MMCmobile™ protocols – Temporary write protection – 52 MHz clock speed (MAX) – Boot operation (high-speed boot) – Sleep mode – Reliable WRITE – Replay-protected memory block (RPMB) – Secure erase and trim – Hardware reset signal – Multiple partitions with enhanced attribute – Permanent and power-on write protection – Backward-compatible with previous MMC modes • ECC and block management implemented • Deviations from the JEDEC specification are described in the last section of this data sheet. PDF: 09005aef838eabba emmc_rev_q_v4_41_153b_169b_j534q567r.pdf - Rev. C 7/10 EN • Density: 4GB, 8GB, 16GB, 32GB • Temperature range – Industrial temperature: –40˚C to +85˚C 1 IT Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2009 Micron Technology, Inc. All rights reserved. Products and specifications discussed herein are subject to change by Micron without notice.

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