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NTGS3441T1G

製品説明
仕様・特性

NTGS3441, NVGS3441 Power MOSFET 1 Amp, 20 Volts, P−Channel TSOP−6 Features • • • • • Ultra Low RDS(on) Higher Efficiency Extending Battery Life Miniature TSOP−6 Surface Mount Package NV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable These Devices are Pb−Free and are RoHS Compliant http://onsemi.com 1 AMPERE 20 VOLTS RDS(on) = 90 mW P−Channel Applications 1 2 5 6 • Power Management in Portable and Battery−Powered Products, i.e.: Cellular and Cordless Telephones, and PCMCIA Cards MAXIMUM RATINGS (TJ = 25°C unless otherwise noted) Rating Symbol 3 Value Unit Drain−to−Source Voltage VDSS −20 V Gate−to−Source Voltage − Continuous VGS "8.0 V Thermal Resistance Junction−to−Ambient (Note 1) Total Power Dissipation @ TA = 25°C Drain Current − Continuous @ TA = 25°C − Pulsed Drain Current (Tp t 10 mS) RqJA Pd ID IDM 244 0.5 −1.65 −10 °C/W W A A Thermal Resistance Junction−to−Ambient (Note 2) Total Power Dissipation @ TA = 25°C Drain Current − Continuous @ TA = 25°C − Pulsed Drain Current (Tp t 10 mS) RqJA Pd ID IDM 128 1.0 −2.35 −14 °C/W W A A Thermal Resistance Junction−to−Ambient (Note 3) Total Power Dissipation @ TA = 25°C Drain Current − Continuous @ TA = 25°C − Pulsed Drain Current (Tp t 10 mS) RqJA Pd ID IDM 62.5 2.0 −3.3 −20 °C/W W A A Operating and Storage Temperature Range TJ, Tstg −55 to 150 °C Maximum Lead Temperature for Soldering Purposes for 10 Seconds TL 260 °C 4 MARKING DIAGRAM & PIN ASSIGNMENT Drain Drain Source 6 5 4 1 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Minimum FR−4 or G−10 PCB, operating to steady state. 2. Mounted onto a 2″ square FR−4 board (1 in sq, 2 oz. Cu. 0.06″ thick single sided), operating to steady state. 3. Mounted onto a 2″ square FR−4 board (1 in sq, 2 oz. Cu. 0.06″ thick single sided), t t 5.0 seconds. TSOP−6 CASE 318G STYLE 1 PT M G PT MG G 1 2 3 Drain Drain Gate = Specific Device Code = Date Code* = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation may vary depending upon manufacturing location. ORDERING INFORMATION Package Shipping† NTGS3441T1G TSOP−6 (Pb−Free) 3000 / Tape & Reel NVGS3441T1G TSOP−6 (Pb−Free) 3000 / Tape& Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2012 October, 2012 − Rev. 6 1 Publication Order Number: NTGS3441T1/D

ブランド

ONS

会社名

ON Semiconductor

本社国名

U.S.A

事業概要

自動車、通信、コンピュータ、コンシューマ、工業、LED照明、医療、軍事/航空および電源アプリケーション向けの電源および信号管理、ロジック、ディスクリートおよびカスタム・デバイスを含む半導体のサプライヤー。

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