SN74LV244AT
OCTAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCES572C – JUNE 2004 – REVISED AUGUST 2005
FEATURES
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Ioff Supports Partial-Power-Down Mode
Operation
Latch-Up Performance Exceeds 250 mA Per
JESD 17
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
RGY PACKAGE
(TOP VIEW)
1
20
2
19
18
3
4
5
17
6
7
15
8
9
13
12
10
11
16
14
1
VCC
2OE
1Y1
2A4
1Y2
2A3
1Y3
2A2
1Y4
2A1
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
20
19 2OE
18 1Y1
17 2A4
2
3
4
6
16 1Y2
15 2A3
7
8
14 1Y3
13 2A2
9
12 1Y4
5
10
11
GND
1OE
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
GND
1OE
DB, DGV, DW, NS, OR PW PACKAGE
(TOP VIEW)
VCC
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Inputs Are TTL-Voltage Compatible
4.5-V to 5.5-V VCC Operation
Typical tpd = 5.4 ns at 5 V
Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 5 V, TA = 25°C
Typical VOHV (Output VOH Undershoot)
>2.3 V at VCC = 5 V, TA = 25°C
Supports Mixed-Mode Voltage Operation on
All Ports
2A1
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DESCRIPTION/ORDERING INFORMATION
This octal buffer/driver is designed specifically to improve both the performance and density of 3-state
memory-address drivers, clock drivers, and bus-oriented receivers and transmitters.
The SN74LV244AT is organized as two 4-bit buffers/line drivers with separate output-enable (OE) inputs. When
OE is low, the device passes data from the A inputs to the Y outputs. When OE is high, the outputs are in the
high-impedance state.
ORDERING INFORMATION
PACKAGE (1)
TA
QFN – RGY
ORDERABLE PART NUMBER
TOP-SIDE MARKING
Reel of 1000
SN74LV244ATRGYR
Tube of 25
SN74LV244ATDW
Reel of 2000
SN74LV244ATDWR
SOP – NS
Reel of 2000
SN74LV244ATNSR
74LV244AT
SSOP – DB
Reel of 2000
SN74LV244ATDBR
LV244AT
Tube of 70
SN74LV244ATPW
Reel of 2000
SN74LV244ATPWR
Reel of 250
SN74LV244ATPWT
Reel of 2000
SN74LV244ATDGVR
SOIC – DW
–40°C to 85°C
TSSOP – PW
TVSOP – DGV
(1)
VV244
LV244AT
LV244AT
LV244AT
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2004–2005, Texas Instruments Incorporated