NTLJF4156N
Power MOSFET and
Schottky Diode
30 V, 4.6 A, mCool] N−Channel, with
2.0 A Schottky Barrier Diode, 2x2 mm
WDFN Package
http://onsemi.com
MOSFET
Features
• WDFN Package Provides Exposed Drain Pad for Excellent Thermal
•
•
•
•
•
Conduction
Co−Packaged MOSFET and Schottky For Easy Circuit Layout
RDS(on) Rated at Low VGS(on) Levels, VGS = 1.5 V
Low Profile (< 0.8 mm) for Easy Fit in Thin Environments
Low VF Schottky
This is a Pb−Free Device
V(BR)DSS
RDS(on) MAX
ID MAX (Note 1)
70 mW @ 4.5 V
30 V
4.6 A
90 mW @ 2.5 V
125 mW @ 1.8 V
250 mW @ 1.5 V
SCHOTTKY DIODE
VR MAX
Applications
VF TYP
IF MAX
30 V
0.47 V
2.0 A
• DC−DC Converters
• Li−Ion Battery Applications in Cell Phones, PDA’s, Media Players
• Color Display and Camera Flash Regulators
D
A
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Symbol
Parameter
Value
Unit
Drain−to−Source Voltage
VDSS
30
V
Gate−to−Source Voltage
VGS
±8.0
V
ID
3.7
A
G
Continuous Drain
Current (Note 1)
TJ = 25°C
TJ = 85°C
TJ = 25°C
Power Dissipation
(Note 2)
SCHOTTKY DIODE
4.6
Steady
State
PD
W
1.5
2.3
TJ = 25°C
Steady
State
MARKING
DIAGRAM
TJ = 25°C
t≤5s
Continuous Drain
Current (Note 2)
N−CHANNEL MOSFET
2.7
t≤5s
Power Dissipation
(Note 1)
Steady
State
K
S
ID
TJ = 85°C
1
6
2 JLMG 5
3
4
G
1
WDFN6
CASE 506AN
A
2.5
JL = Specific Device Code
M = Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
PIN CONNECTIONS
1.8
PD
0.71
IDM
20
A
TJ, TSTG
−55 to
150
°C
Source Current (Body Diode) (Note 2)
IS
2.4
A
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
TL
260
°C
Pulsed Drain Current
TJ = 25°C
tp = 10 ms
Operating Junction and Storage Temperature
June, 2006 − Rev. 4
1
1
N/C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq
[1 oz] including traces).
2. Surface Mounted on FR4 Board using the minimum recommended pad size
of 30 mm2, 2 oz. Cu.
© Semiconductor Components Industries, LLC, 2006
K
A
6
2
K
5
G
4
S
D
D
3
(Top View)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 7 of this data sheet.
Publication Order Number:
NTLJF4156N/D
