B1 thru B10
SURFACE MOUNT
GLASS PASSIVATED
BRIDGE RECTIFIERS
CHENG- YI
ELECTRONIC
REVERSE VOLTAGE -100 to 1000 Volts
FORWARD CURRENT -0.8 Amperes
.019 (0.48)
.027 (0.71)
~
.095 (2.41) .180 (4.57)
.105 (2.67) .190 (4.83)
~
FEATURES
+
.145 (3.68)
.155 (3.94)
Rating to 1000V PRV
Ideal for printed circuit board
Reliable low cost construction utilizing molded
plastic technique results in inexpensive product
Lead in plated copper
Notch in case
.195 (4.95)
.205 (5.21)
.007 (0.18)
.013 (0.33)
MECHANICAL DATA
.020 (0.51)
.028 (0.71)
.096 (2.44)
.100 (2.54)
.008 (0.20)
.012 (0.30)
.107 (2.72)
.117 (2.97)
M
o
.100 (2.54)
.038 (0.96)
.047 (1.19)
o
0 (0 )
10o (10o)
Polarity: Symbol molded on body
Weight: 0.0044 ounces, 0.125 grams
Mounting position: Any
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 250C ambient temperature unless otherwise specified.
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
B1
B2
B4
B6
B8
B10
UNITS
1000
V
Maximum Recurrent Peak Reverse Voltage
VRRM
100
200
400
600
800
Maximum RMS Bridge Input Voltage
VRMS
70
140
280
420
560
700
V
Maximum DC Blocking Voltage
VDC
100
200
400
600
800
1000
V
Maximum Average Forward
Rectified Current (Note 1) @ TA=40
V(AV)
0.8
A
Peak Forward Surge Current
8.3ms single half sine-wave
super imposed on rated load (JEDEC Method)
IFSM
30
A
Maximum Forward Voltage at 0.4A DC
VF
1.0
V
Maximum DC Reverse Current @ TJ=25 C
at rated DC Blocking Voltage @ TJ=125 C
IR
0
C
0
0
Typical Junction Capacitance per element (Note2)
Typical Thermal Resistance (Note3)
Operating Temperature Range
Storage Temperature Range
CJ
R
JA
TJ
TSTG
NOTES: 1.Mounted on P Board.
.C.
2.Measured at 1.0MHz and applied reverse voltage of 4.0V DC.
3. Thermal Resistance Junction to Ambient.
A
5
500
pF
15
75
0
C/W
-55 to +150
0
-55 to +150
0
C
C
