AXT5, 6
For board-to-FPC
F4S Series
Narrow pitch connectors
(0.4mm pitch)
FEATURES
1. Space-saving (3.6 mm widthwise)
Smaller compared to F4 series (40 pin
contacts):
Socket — 27% smaller,
Header — 38% smaller
m
6m
2.
m
6m
3.
Socket
3. Simple lock structure provides
tactile feedback to ensure excellent
mating/unmating operation feel.
Header
Socket
ts)
tac
on
RoHS compliant
.50
(40
c
pin
10
3.6
0
Pickup width: 0.8mm
Soldering terminals
at each corner
Soldering terminals
at each corner
Header
ts)
tac
on
40
0(
9.8
2.6
0
c
pin
Simple lock structure
4. Gull-wing-shaped terminals to
facilitate visual inspections.
5. Connectors for inspection available
APPLICATIONS
Mobile devices, such as cellular
phones, digital still cameras and
digital video cameras.
2. Strong resistance to adverse
environments! Utilizes
“
” construction
for high contact reliability.
ORDERING INFORMATION
AXT
4
5: Narrow Pitch Connector F4S (0.4 mm pitch) Socket
6: Narrow Pitch Connector F4S (0.4 mm pitch) Header
Number of pins (2 digits)
Mated height
1: For mated height 1.0 mm
2: For mated height 1.2 mm
1: For mated height 1.0 mm
2: For mated height 1.2 mm
Functions
2: Without positioning bosses
Surface treatment (Contact portion / Terminal portion)
4: Base: Ni plating Surface: Au plating (for Ni barrier available)
4: Base: Ni plating Surface: Au plating
Note: Please note that models with a mated height of 1.0 mm (7th digit of part number is “1”) and 1.2 mm (7th digit of part number is “2”) are not compatible.
ACCTB29E 201209-T
Panasonic Corporation
Automation Controls Business Unit
industrial.panasonic.com/ac/e/
AXT5, 6
SPECIFICATIONS
1. Characteristics
Item
Rated current
Rated voltage
150V AC for 1 min.
Min. 1,000MΩ (initial)
Contact resistance
Mechanical
characteristics
Breakdown voltage
Insulation resistance
Electrical
characteristics
Specifications
0.3A/pin contact (Max. 5 A at total pin contacts)
60V AC/DC
Max. 90mΩ
Composite insertion force
Composite removal force
Contact holding force
(Socket contact)
Ambient temperature
Max. 0.981N/pin contacts × pin contacts (initial)
Min. 0.165N/pin contacts × pin contacts
Soldering heat resistance
Storage temperature
Conditions
No short-circuiting or damage at a detection current of 1 mA
when the specified voltage is applied for one minute.
Using 250V DC megger (applied for 1 min.)
Based on the contact resistance measurement method
specified by JIS C 5402.
Measuring the maximum force.
As the contact is axially pull out.
No freezing at low temperatures. No dew condensation.
Min. 0.49N/pin contacts
–55°C to +85°C
Peak temperature: 260°C or less (on the surface of
the PC board around the connector terminals)
300°C within 5 sec. 350°C within 3 sec.
–55°C to +85°C (product only)
–40°C to +50°C (emboss packing)
Infrared reflow soldering
Soldering iron
No freezing at low temperatures. No dew condensation.
Conformed to MIL-STD-202F, method 107G
Environmental
characteristics
Thermal shock resistance
(header and socket mated)
H2S resistance
(header and socket mated)
120 hours,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
24 hours,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
48 hours,
contact resistance max. 90mΩ
Insertion and removal life
50 times
Humidity resistance
(header and socket mated)
Saltwater spray resistance
(header and socket mated)
Lifetime
characteristics
Unit weight
Order Temperature (°C)
0
1
–55 −3
2
3
85 +3
0
4
0
–55 −3
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
Time (minutes)
30
Max. 5
30
Max. 5
Bath temperature 40±2°C,
humidity 90 to 95% R.H.
Bath temperature 35±2°C,
saltwater concentration 5±1%
Bath temperature 40±2°C, gas concentration 3±1 ppm,
humidity 75 to 80% R.H.
Repeated insertion and removal speed of max. 200 times/
hours
20 pin contact type: Socket: 0.03 g Header: 0.01 g
2. Material and surface treatment
Part name
Molded
portion
Contact and
Post
Material
LCP resin
(UL94V-0)
Surface treatment
—
Copper alloy
ACCTB29E 201209-T
Contact portion: Base: Ni plating Surface: Au plating
Terminal portion: Base: Ni plating Surface: Au plating (except the terminal tips)
The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel portions).
Soldering terminals: Sockets: Base: Ni plating Surface: Pd+Au flash plating (except the terminal tips)
Headers: Base: Ni plating Surface: Au plating (except the terminal tips)
Panasonic Corporation
Automation Controls Business Unit
industrial.panasonic.com/ac/e/
