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CY6264-70SNC

製品説明
仕様・特性

CY6264 8K x 8 Static RAM Features power-down feature (CE1), reducing the power consumption by over 70% when deselected. The CY6264 is packaged in a 450-mil (300-mil body) SOIC. • 55, 70 ns access times • CMOS for optimum speed/power • Easy memory expansion with CE1, CE2, and OE features • TTL-compatible inputs and outputs • Automatic power-down when deselected Functional Description The CY6264 is a high-performance CMOS static RAM organized as 8192 words by 8 bits. Easy memory expansion is provided by an active LOW chip enable (CE1), an active HIGH chip enable (CE2), and active LOW output enable (OE) and three-state drivers. Both devices have an automatic An active LOW write enable signal (WE) controls the writing/reading operation of the memory. When CE1 and WE inputs are both LOW and CE2 is HIGH, data on the eight data input/output pins (I/O0 through I/O7) is written into the memory location addressed by the address present on the address pins (A0 through A12). Reading the device is accomplished by selecting the device and enabling the outputs, CE1 and OE active LOW, CE2 active HIGH, while WE remains inactive or HIGH. Under these conditions, the contents of the location addressed by the information on address pins is present on the eight data input/output pins. The input/output pins remain in a high-impedance state unless the chip is selected, outputs are enabled, and write enable (WE) is HIGH. A die coat is used to insure alpha immunity. Logic Block Diagram Pin Configuration SOIC Top View I/O0 INPUT BUFFER SENSE AMPS A1 A2 A3 A4 A5 A6 A7 A8 ROW DECODER I/O1 256 x 32 x 8 ARRA Y I/O2 I/O3 I/O4 NC A4 A5 A6 A7 A8 A9 A10 A11 A12 I/O0 I/O1 I/O2 GND 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 VCC WE CE2 A3 A2 A1 OE A0 CE1 I/O7 I/O6 I/O5 I/O4 I/O3 I/O5 I/O6 CE1 CE2 WE COLUMN DECODER POWER DOWN I/O7 3901 North First Street • Cypress Semiconductor Corporation Document #: 001-02367 Rev. ** A12 A11 A9 A10 A0 OE • San Jose, CA 95134 • 408-943-2600 Revised June 27, 2005 CY6264 Switching Characteristics Over the Operating Range[3] 6264-55 Parameter Description Min. 6264-70 Max. Min. Max. Unit READ CYCLE tRC Read Cycle Time 55 tAA Address to Data Valid tOHA Data Hold from Address Change tACE1 CE1 LOW to Data Valid 55 70 ns tACE2 CE2 HIGH to Data Valid 40 70 ns tDOE OE LOW to Data Valid 35 ns tLZOE OE LOW to Low Z 55 5 OE HIGH to High tLZCE1 CE1 LOW to Low Z[5] tLZCE2 CE2 HIGH to Low Z tHZCE tPU CE1 LOW to Power-Up tPD CE1 HIGH to Power-Down WRITE 70 25 CE1 HIGH to High Z[4, 5] CE2 LOW to High Z ns ns 5 3 Z[4] tHZOE 70 ns 5 20 5 ns 30 ns 5 3 ns 5 20 0 ns 30 ns 0 25 ns 30 ns CYCLE[6] tWC Write Cycle Time 50 70 ns tSCE1 CE1 LOW to Write End 40 60 ns tSCE2 CE2 HIGH to Write End 30 50 ns tAW Address Set-Up to Write End 40 55 ns tHA Address Hold from Write End 0 0 ns tSA Address Set-Up to Write Start 0 0 ns tPWE WE Pulse Width 25 40 ns tSD Data Set-Up to Write End 25 35 ns tHD Data Hold from Write End 0 0 ns [4] tHZWE WE LOW to High Z tLZWE WE HIGH to Low Z 20 30 ns 5 5 ns Test Conditions Max. Unit 7 pF 7 pF Shaded areas contain advance information. Capacitance[7] Parameter Description CIN Input Capacitance COUT Output Capacitance TA = 25°C, f = 1 MHz, VCC = 5.0V Notes: 3. Test conditions assume signal transition time of 5 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V, and output loading of the specified IOL/IOH and 30-pF load capacitance. 4. tHZOE, tHZCE, and tHZWE are specified with CL = 5 pF as in part (b) of AC Test Loads. Transition is measured ±500 mV from steady-state voltage. 5. At any given temperature and voltage condition, tHZCE is less than tLZCE for any given device. 6. The internal write time of the memory is defined by the overlap of CE1 LOW, CE2 HIGH, and WE LOW. Both signals must be LOW to initiate a write and either signal can terminate a write by going HIGH. The data input set-up and hold timing should be referenced to the rising edge of the signal that terminates the write. 7. Tested initially and after any design or process changes that may affect these parameters. Document #: 001-02367 Rev. ** Page 3 of 10

ブランド

CYPRESS

会社名

Cypress Semiconductor

本社国名

U.S.A

事業概要

主力製品は、NOR型フラッシュ・メモリ、F-RAMおよびSRAM Traveoマイクロコントローラ、業界唯一のPSoCソリューション、アナログ回路、PMIC、CapSense capacitive touch-sensingコントローラ、Wireless BLE Bluetooth Low-Energy、そしてUSB connectivityソリューションである。 2015年にスパンション社と合併し、フラッシュメモリ、マイクロコントローラ、ミックスドシグナル製品およびアナログ製品も強化も行っています。

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