F-214
QTE–014–01–F–D–DP–A
®
QTE–040–01–L–D–A
QTE–060–01–L–D–A
(0,80 mm) .0315"
QTE SERIES
HIGH SPEED GROUND PLANE HEADER
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?QTE
Insulator Material:
Liquid Crystal Polymer
Terminal Material:
Phosphor Bronze
Plating: Au or Sn over
50µ" (1,27 µm) Ni
Current Rating:
Contact:
2 A per pin
(1 pin powered per row)
Ground Plane:
11.6 A per ground plane
(1 ground plane powered)
Operating Temp Range:
-55°C to +125°C
Voltage Rating:
225 VAC mated with QSE
& 5 mm Stack Height
Max Cycles: 100
RoHS Compliant: Yes
Processing:
Lead–Free Solderable: Yes
SMT Lead Coplanarity:
(0,10 mm) .004" max (020-060)
Board Stacking:
For applications requiring
more than two connectors per
board contact ipg@samtec.com
Integral metal plane
for power or ground
Board Mates:
QSE
s
ocol
Prot orted
Supp
Cable Mates:
EQCD, EQDP, EQRF
(See Also Available note)
100 GbE
XAUI ®
PCI Express
SATA
t I/O)
MGT (Rocke ™
finiBand
In
notes at
Download app ppnote
/a
w.samtec.com c.com
ww
te
t SIG @ sam
Contac
ols
ns on protoc
for questio
Rated @ 3dB Insertion Loss
with PCB effects* w/o PCB effects**
Single-Ended Signaling
–D
9 GHz / 18 Gbps
9 GHz / 18 Gbps
Differential Pair Signaling
–D
8 GHz / 16 Gbps
14 GHz / 28 Gbps
Differential Pair Signaling
–DP 8.5 GHz / 17 Gbps 13.5 GHz / 27 Gbps
*Performance data includes effects of a non-optimized PCB.
**Test board losses de-embedded from performance data.
Performance data for other stack heights and complete test data
available at www.samtec.com?QTE or contact sig@samtec.com
QTE/QSE
5 mm Stack Height
Type
LEAD
STYLE
RECOGNITIONS
–020, –040, –060
(40 total pins per bank = –D)
–014, –028, –042
PLATING
OPTION
Specify
LEAD
STYLE
from
chart
PINS PER ROW
NO. OF PAIRS
QTE
For complete scope
of recognitions see
www.samtec.com/quality
–F
–D
= Gold Flash
on Signal Pins and
Ground Plane,
Matte Tin on tails
= Single-Ended
(14 pairs per bank = –D–DP)
FILE NO: 090871_0_000
ALSO AVAILABLE
01
= 10µ" (0,25 µm)
Gold on Signal Pins
and Ground Plane,
Matte Tin on tails
–D = (No. of Positions per Row/20)
x (20,00) .7875
(20,00) .7875
(5,97)
.235
(7,11)
.280
02
(0,80)
.0315
(0,20)
.008
A
(0,76)
.030
(0,89)
.035 DIA
–L
(0,64)
.025
WWW.SAMTEC.COM
A
TYPE
OTHER
OPTION
–K
–L
–D–DP = (No. of Positions per Row/14)
x (20,00) .7875
(MOQ Required)
• 14mm, 15 mm, 22 mm
and 30 mm stack height
(Caution: Some automatic
placement/inspection
machines may have
component height
restrictions. Please consult
machinery specifications.)
• 30µ" (0,76 µm) Gold
(Specify -H plating for
Data Rate cable mating
applications.)
• Edge Mount
• 56 (-DP), 80, 100
positions per row
• Guide Posts, Screw Down
& Friction Lock
• Retention Option
Contact Samtec.
Standard stack heights
from 5 mm to 25 mm
–C*
= Electro-Polished
Selective
50µ" (1,27 µm) min
Au over 150µ"
(3,81 µm) Ni on Signal
Pins in contact area,
10µ" (0,25 µm) min Au
over 50µ" (1,27 µm) Ni
on Ground Plane
in contact area,
Matte Tin over 50µ"
(1,27 µm) min Ni on
all solder tails
–D–DP
= Differential Pair
(–01 only)
QTE
LEAD
STYLE
–01
–02
–03
–04
–05
–07
= (7,00 mm)
.275" DIA
Polyimide
Film Pick &
Place Pad
–TR
= Tape & Reel
Packaging
(N/A –05 & –07
HEIGHT
lead style)
WITH
QSE*
A
(4,27)
.168
(7,26)
.286
(10,27)
.404
(15,25)
.600
(18,26)
.718
(24,24)
.954
(5,00)
.197
(8,00)
.315
(11,00)
.433
(16,00)
.630
(19,00)
.748
(25,00)
.984
–L
= Latching
Option
(N/A on –042 &
–060 positions)
*Processing conditions
will affect mated height.
*Note: –C Plating passes
10 year MFG testing
Note: Some lengths, styles
and options are non-standard,
non-returnable.
OTHER
SOLUTIONS
• Board Spacing Standoffs.
See SO Series
