2Gb: x4, x8, x16 DDR2 SDRAM
Features
DDR2 SDRAM
MT47H512M4 – 64 Meg x 4 x 8 banks
MT47H256M8 – 32 Meg x 8 x 8 banks
MT47H128M16 – 16 Meg x 16 x 8 banks
Options1
Features
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• Configuration
– 512 Meg x 4 (64 Meg x 4 x 8 banks)
– 256 Meg x 8 (32 Meg x 8 x 8 banks)
– 128 Meg x 16 (16 Meg x 16 x 8 banks)
• FBGA package (Pb-free) – x16
– 84-ball FBGA (11.5mm x 14mm) Rev. A
• FBGA package (Pb-free) – x4, x8
– 60-ball FBGA (11.5mm x 14mm) Rev. A
• FBGA package (Pb-free) – x16
– 84-ball FBGA (9mm x 12.5mm) Rev. C
• FBGA package (Pb-free) – x4, x8
– 60-ball FBGA (9mm x 11.5mm) Rev. C
• FBGA package (Lead solder) – x16
– 84-ball FBGA (9mm x 12.5mm) Rev. C
• Timing – cycle time
– 1.875ns @ CL = 7 (DDR2-1066)
– 2.5ns @ CL = 5 (DDR2-800)
– 2.5ns @ CL = 6 (DDR2-800)
– 3.0ns @ CL = 4 (DDR2-667)
– 3.0ns @ CL = 5 (DDR2-667)
– 3.75ns @ CL = 4 (DDR2-533)
– 5.0ns @ CL = 3 (DDR2-400)
• Self refresh
– Standard
• Operating temperature
– Commercial (0°C T C +85°C)
– Industrial (–40°C T C +95°C;
–40°C T A +85°C)
• Revision
VDD = 1.8V ±0.1V, V DDQ = 1.8V ±0.1V
JEDEC-standard 1.8V I/O (SSTL_18-compatible)
Differential data strobe (DQS, DQS#) option
4n-bit prefetch architecture
Duplicate output strobe (RDQS) option for x8
DLL to align DQ and DQS transitions with CK
8 internal banks for concurrent operation
Programmable CAS latency (CL)
Posted CAS additive latency (AL)
WRITE latency = READ latency - 1 tCK
Programmable burst lengths: 4 or 8
Adjustable data-output drive strength
64ms, 8192-cycle refresh
On-die termination (ODT)
Industrial temperature (IT) option
RoHS-compliant
Supports JEDEC clock jitter specification
Note:
PDF: 09005aef824f87b6
2Gb_DDR2.pdf – Rev. G 7/11 EN
1
Marking
512M4
256M8
128M16
HG
HG
RT
EB
PK
-187E
-25E
-25
-3E
-3
-37E
-5E
None
None
IT
:A/:C
1. Not all options listed can be combined to
define an offered product. Use the Part
Catalog Search on www.micron.com for
product offerings and availability.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2006 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.
2Gb: x4, x8, x16 DDR2 SDRAM
Features
FBGA Part Number System
Due to space limitations, FBGA-packaged components have an abbreviated part marking that is different from the
part number. For a quick conversion of an FBGA code, see the FBGA Part Marking Decoder on Micron’s Web site:
http://www.micron.com.
PDF: 09005aef824f87b6
2Gb_DDR2.pdf – Rev. G 7/11 EN
3
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2006 Micron Technology, Inc. All rights reserved.
