MA4E2508 Series
SURMOUNTTM Low, Medium, & High Barrier Silicon
Schottky Diodes: Anti-Parallel Pair
Features
M/A-COM Products
Rev. V3
Case Style 1112
• Extremely Low Parasitic Capitance & Inductance
• Surface Mountable in Microwave Circuits, No
Wirebonds Required
• Rugged HMIC Construction with polyimide
Scratch Protection
• Reliable, Multilayer Metalization with a Diffusion
Barrier, 100 % Stabilization Bake (300°C, 16
hours)
• Lower Susceptibility to ESD Damage
A
B
Description
The MA4E2508 SURMOUNTTM Anti-Parallel Diode
Series are Silicon Low, Medium, & High Barrier
Schottky Devices fabricated with the patented Heterolithic Microwave Integrated Circuit (HMIC) process. HMIC circuits consist of Silicon pedestals
which form diodes or via conductors embedded in
a glass dielectric, which acts as the low dispersion,
low loss, microstrip transmission medium. The
combination of silicon and glass allows HMIC devices to have excellent loss and power dissipation
characteristics in a low profile, reliable device.
C
D
E
D
Case Style 1112
DIM
INCHES
MILLIMETERS
MAX.
MIN.
MAX.
A
The Surmount Schottky devices are excellent
choices for circuits requiring the small parasitics of
a beam lead device coupled with the superior mechanical performance of a chip. The SurMount
structure employs very low resistance silicon vias
to connect the Schottky contacts to the metalized
mounting pads on the bottom surface of the chip.
These devices are reliable, repeatable, and a lower
cost performance solution to conventional devices.
They have lower susceptibility to electrostatic discharge than conventional beam lead Schottky diodes.
MIN.
0.0445
0.0465
1.130
1.180
B
0.0169
0.0189
0.430
0.480
C
0.0040
0.0080
0.102
0.203
D Sq.
0.0128
0.0148
0.325
0.375
E
0.0128
0.0148
0.325
0.375
Equivalent Circuit
The multi-layer metalization employed in the fabrication of the Surmount Schottky junctions includes
a platinum diffusion barrier, which permits all devices to be subjected to a 16-hour non-operating
stabilization bake at 300°C.
The “0502” outline allows for Surface Mount placement and multi- functional polarity orientations.
1
ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for
• North America Tel: 800.366.2266 / Fax: 978.366.2266
development. Performance is based on target specifications, simulated results, and/or prototype
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
measurements. Commitment to develop is not guaranteed.
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under developVisit www.macom.com for additional data sheets and product information.
ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has
been fixed. Engineering samples and/or test data may be available. Commitment to produce in
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or
volume is not guaranteed.
information contained herein without notice.
