0.4
mm
Pitch
Series
Series
Stacking Height
Pitch
No. of Positions
Rated Current)
Rated Voltage
D.W.Voltage
5801
5801
0.8mm
0.4mm
10
80
AC/DC 0.3A
AC/DC 50V
AC 250Vrms/min.
Copper alloy
Contact Material)
Heat resistance plastic
Insulator Material)
Operating Temperature)
40
85
SERIES 5801
5801
PHS
0.8mm
AV
5.0mm
0.4mm
Outline
Series 5801 is a 0.4mm pitch Board to Board connector to meet the market requirement for downsizing and thinner tendency in
cellular phones, PHS, and Digital AV apparatus. 0.8mm in stacki ng height and 5.0mm in width including tails are realized.
(1)
(2)
S
H=0.8
(3)
(4)
(5)
FINE-LOCK
GROUND
POWER
(6)
Features
(1) KEC-unique S-shaped spring is adopted for the spring structure, which realizes the lowest profile of 0.8mm in this field.
(2) Because no part of pins were exposed owing to the bottom wall of the connector in spite of its slim and low profile, a pattern
can be laid between lands of tail rows, which enables less limited pattern layouts on boards.
(3) The pinching structure, highly resistant to vibration and drop shock, is adopted in contacts and the original structure excluding splashed flux or foreign matters attached is adopted on contacting points in order to obtain high contacting reliability.
(4) "Fine locking mechanism" adopted for mating structure realizes the nice clicking response and firm retention force against
unmating despite of the ultra low profile.
(5) The metal tab reinforces the locking strength and is utilized for electrical connection such as "Ground", "Power" line or so.
(6) A checker connector to be mated with a connector is also available to check electrical continuity or short circuit of the connector.
Recommended plating types are mentioned in this catalogue.
For other plating types and their specifications, and available numbers of positions, please feel free to contact our sales depart ment.
