3.5mm Dia. Jacks
■ Features
1. A small ø3.5mm jack that was developed for small, mobile
equipment.
2. A wide selection is available including surface mounting,
DIP, spring terminal, and mid mount types.
1.Electric Performance
Rating
: 1A, 12V DC
Contact Resistance
: 30mΩ max, 50mΩ max.
Insulation Resistance : 100MΩ min.500V DC
Withstanding Voltage : 500V AC(for one minute)
2.Mechanical Performance
Insertion Force
: 35N max. at 3.5mm Dia.gauge
Withdrawal Force
: 3 to 35N at 3.5mm Dia.gauge
■ Application
Smart phones, mobile phones, tablet PCs, portable audio,
other small AV equipment.
(LGY2209-0101F)
2
0
1
Circuits
2
3
4
1
Metal Sleeve
Without
With
2
3
1.8
le)
2(Ho
.
2-ø1
1.8
12
P.C. Board Dimension
(Top View)
Reflow Soldering
(500pcs/reel)
F
2
12
4.4
ø5
ø3.
2
3
4
1
ø1
.2
2.2
Circuits
2
4
2.4
7.5
1
3
3.5
2-
1.9
5.35
9
4-1.5x0.7
4-2
LGY2209-03
1
2
3.5
1.8
4
SMD Type
1.8
7.5
2
2
3
2.75
2.75
3
2
0.4
4.4
2.2
0.05 0.1
(Terminal position
range)
ø5
ø3.
9-0101F
5.35
LGY22
9
Mini Jacks
■ Specification
P.C. Board Dimension
(Bottom View)
2.4
[t=0.8]
DIP Type
12
00
40
Housing Color
Black
Yellow
Manual Soldering
