Freescale Semiconductor
Data Sheet: Technical Data
Document Number: IMX51CEC
Rev. 6, 10/2012
IMX51
i.MX51 Applications
Processors for Consumer and
Industrial Products
Package Information
Plastic Package
Case 2058 13 x 13 mm, 0.5 mm pitch
Case 2017 19 x 19 mm, 0.8 mm pitch
Ordering Information
See Table 1 on page 3 for ordering information.
1
Introduction
The i.MX51 multimedia applications processors
represent Freescale Semiconductor’s latest addition to a
growing family of multimedia-focused products that
offer high performance processing and are optimized for
lowest power consumption.
The i.MX51 processors feature Freescale’s advanced and
power-efficient implementation of the ARM
Cortex™-A8 core, which operates at speeds as high as
800 MHz. Up to 200 MHz DDR2 and mobile DDR
DRAM clock rates are supported. These devices are
suitable for applications such as the following:
• Netbooks (web tablets)
• Nettops (Internet desktop devices)
• Mobile Internet devices (MID)
• Portable media players (PMP)
• Portable navigation devices (PND)
• High-end PDAs
• Gaming consoles
• Automotive navigation and entertainment (see
automotive data sheet, IMX51AEC)
© 2012 Freescale Semiconductor, Inc. All rights reserved.
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 3
1.2. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1. Special Signal Considerations . . . . . . . . . . . . . . . 12
3. IOMUX Configuration for Boot Media . . . . . . . . . . . . . . . 14
3.1. NAND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.2. SD/MMC IOMUX Pin Configuration . . . . . . . . . . . 15
3.3. I2C IOMUX Pin Configuration . . . . . . . . . . . . . . . . 15
3.4. eCSPI/CSPI IOMUX Pin Configuration . . . . . . . . 16
3.5. Wireless External Interface Module (WEIM) . . . . 16
3.6. UART IOMUX Pin Configuration . . . . . . . . . . . . . 16
3.7. USB-OTG IOMUX Pin Configuration . . . . . . . . . . 16
4. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 17
4.1. Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . 17
4.2. Supply Power-Up/Power-Down Requirements and
Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
4.3. I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 24
4.4. Output Buffer Impedance Characteristics . . . . . . 31
4.5. I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 35
4.6. Module Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
4.7. External Peripheral Interfaces . . . . . . . . . . . . . . . 74
5. Package Information and Contact Assignments . . . . . 153
5.1. 13 x 13 mm Package Information . . . . . . . . . . . . 153
5.2. 19 x 19 mm Package Information . . . . . . . . . . . . 173
5.3. 13 × 13 mm, 0.5 Pitch Ball Map . . . . . . . . . . . . . 191
5.4. 19 x 19 mm, 0.8 Pitch Ball Map . . . . . . . . . . . . . 195
6. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 199
