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http://www.tekcon.com
http://www.tekcon.com.tw
3592 Series
DIMM Socket
1.27 mm Pitch, Forming Type
Ordering Information
3592 - X X X - XX X
Contact Plating
A - Gold Flash all area
0 - Gold Flash/Tin
1 - 10 µ" Gold/Tin
2 - 20 µ" Gold/Tin
3 - 30 µ" Gold/Tin
4 - 3 µ" Gold/Tin
5 - 15 µ" Gold/Tin
8 - Tin
Voltage Key
3 - apply 3.3 V module
5 - apply 5 V module
Housing Material
1 - LCP, Black
2 - LCP, Ivory
5 - Ny66, Black
6 - Ny66, Ivory
7 - PBT, Black
8 - PBT, Ivory
p Electrical:
s Insulation Resistance:
10,000 MΩ Minimum.
s Dielectric Withstanding Voltage:
1000 VAC R.M.S.
s Voltage Rating: 500V.
s Current Rating: 1 AMP.
s Contact Resistance:
30 mΩ Maximum.
s Capacitance: 1 PF (Max.) at 1Mhz between
randomly selected adjacent contacts.
p Mechanical
s Durability: 25 cycles Minimum.
s Contact Engaging Force: 1.390N Maximum,
Pair Contact.
s Contact Retention Force: 500 g Minimum,
per Contact.
s Accept Standard JEDEC Modules:
0.05 +/- 0.004
p Enviromental
s Temperature: -558C to +1058C
With Post Position
51- with A,B,C Metal Clip
52- with B,C,D Metal Clip
Function Key (DRAM Key)
1-offset Left Key. (SDRAM)
2-offset Centered Key(DRAM)
3-offset Right Key (Unbuffered DRAM)
Specification
p Materials:
s Housing & Latch:
High Temperature Glass Fiber Reinforced
Thermoplastic, UL94V-0.
s Contact: Copper Alloy.
s Plating: Gold Flash on Contact Area and Tin/
Lead on Solder Tail.
Dimensions
TEKCON Electronics Corporation
11-1
