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部品型式

HSMA-C191

製品説明
仕様・特性

HSMx-C110/C170/C190/C191/C150 High Performance ChipLED Data Sheet HSMA-C110/C170/C190/C191/C150 HSML-C110/C170/C190/C191/C150 HSMC-C110/C170/C190/C191/C150 HSMZ-C110/C170/C190 Description Features These chip-type LEDs utilize Aluminum Indium Gallium Phosphide (AlInGaP) material technology. The AlInGaP material has a very high luminous efficiency, capable of producing high light output over a wide range of drive currents. The available colors in this surface mount series are 592 nm Amber, 605 nm Orange, 626/631 nm Red for AS AlInGaP. x High brightness AlInGaP material All packages are binned by both color and intensity, except for red color. x Compatible with IR soldering These ChipLEDs come either in two top emitting packages (HSMx-C170/C190/C191/C150) or in a side emitting package (HSMx-C110). The right angle ChipLEDs are suitable for applications such as LCD backlighting. The top emitting ChipLEDs with wide viewing angle are suitable for light piping and direct backlighting of keypads and panels. In order to facilitate pick and place operation, these ChipLEDs are shipped in tape and reel, with 4000 units per reel for HSMx-C170/C190/C191 and 3000 units per reel for HSMx-C110/C150. These packages are compatible with IR soldering process. x Small size x Industry standard footprint x Diffused optics x Top emitting or right angle emitting x Available in 3 colors (red, orange, amber) x Available in 8 mm tape on 7" diameter reel x Reel sealed in zip locked moisture barrier bags Applications x LCD backlighting x Push button backlighting x Front panel indicator x Symbol indicator x Microdisplays x Small message panel signage CAUTION: HSMA-Cxxx, HSMC-Cxxx, HSML-Cxxx and HSMZ-Cxxx LEDs are Class 1A ESD sensitive per JESD22-A114C.01. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details.

ブランド

AVAGO

現況

2016, Avago Technologies acquires Broadcom Corp. and Broadcom Limited is formed

会社名

Avago Technologies, Inc.

事業概要

ヒューレット・パッカード(HP)、アジレント・テクノロジーの半導体部品部門を前身として、2005年12月に高周波半導体部品および光応用製品のパイオニア、アバゴ・テクノロジーとして新たなスタートを切りました。 光応用製品および高周波半導体部品のパイオニアとして40年という豊富な経験と実績を有しています。

供給状況

 
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