Piezoelectronic Ceramic Filters
Lead type
10.7MHz
FFE series
Issue date:
August 2007
• All specifications are subject to change without notice.
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
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ELECTRICAL CHARACTERISTICS
Part No.
Standard type
FFE1070MA11UXL
FFE1070NA11UXL
FFE1070MS11SBL
FFE1070MJ11FBL
Low loss type
FFE1070MA11UAL
FFE1070NA11UAL
FFE1070MS11SAL
FFE1070MJ11FAL
Group delay time control type
FFE1070NA10UGL∗
FFE1070MS10SGL∗
∗
3dB band width
(kHz)
20dB band width
(kHz)max.
Insertion loss
(dB)max.
SPR attenuation
(dB)min.
280±50
230±50
180±40
150±40
600
570
520
400
6.0
6.0
7.0
10.0
35
35
35
35
280±50
230±50
180±40
150±40
600
570
520
400
5.0
4.5
5.0
7.0
35
35
35
35
230±50
180±40
570
520
6.0
7.0
35
35
Group delay time: 0.50max.
SOLDERABILITY
The lead wires are adopted Pb free plating wire to apply Pb free
soldering. You can also use current Sn-Pb eutectic solder.
RELIABILITY AND TEST CONDITIONS
The following test items are satisfied.
(1) Center frequency: Within ±30kHz
(2) 3dB band width: Within ±20kHz
(3) 20dB band width: Within ±30kHz
(4) Insertion loss: Within ±2dB
(5) Attenuation: 25dB min.
Test items
Low temperature
storage characteristics
High temperature
storage characteristics
Humidity resistance
Thermal shock
Soldering heat resistance
Drop
Vibration
Test conditions
With Rosin-methanol 25% by weight, dip in Sn-Pb
eutectic solder bath at 230±5°C for 3±0.5sec. or
Pb free solder(Sn-3Ag-0.5Cu) bath at 245±2°C
for 3±0.2sec.
Test conditions
Temperature: –40±3°C
Time: 100h
Temperature: +85±2°C
Time: 100h
Loading: DC.5V(between in/out and
ground terminal)
Humidity: 90 to 95(%)RH
Temperature: 60±2°C
Time: 100h
–40°C (30min), 85°C (30min) x 5 cycles
Solder temperature: peak 260°C, 10s flow
Drop 3 times onto a hard wooden board
from a height of 1m
Frequency: 10
55
10Hz/Amplitude: 1.5mm
X, Y and Z directions for 2h each
⇔
Test result
95% minimum of
surface should be
covered by new solder.
RECOMMENDED SOLDERING CONDITIONS
This is the fit product for flow soldering.
FLOW SOLDERING CONDITION
Heat-resistant temperature
Heat-resistant time
Number of times
260±5°C
10±1sec.
1time
⇔
• All specifications are subject to change without notice.
002-01 / 20070815 / ef12_ffe.fm
