SV/Z Series
SV/Z Series Tantalum Chip Capacitors
(Low–ESR Type)
PERFORMANCE CHARACTERISTICS
DIMENSIONS [mm]
Operating temperature range
−55 to +125°C with proper voltage
derating as shown in the following table.
L
W1
L
Y
DC working voltage and surge voltage
H
H
W1
Rated voltage
W2
W2
Z
Z
Z
[B2 cases]
Case
EIA code
Code
Working
Surge
Z
[C, D cases]
at 85°C
4
6.3
10
V
4
6.3
10
V
at 125°C 2.5
5
8
V
at 85°C
8
13
V
5.2
Capacitance (at 20°C, 120 Hz)
Range:
10 µF to 330 µF
Tolerance:
± 20%
L
W1
W2
H
Z
Y
B2
3528
3.5 ± 0.2
2.8 ± 0.2
2.3 ± 0.1
1.9 ± 0.2
0.8 ± 0.2
−
C
6032
6.0 ± 0.2
3.2 ± 0.2
2.2 ± 0.1
2.5 ± 0.2
1.3 ± 0.2
0.4 C
D
7343
7.3 ± 0.2
4.3 ± 0.2
2.4 ± 0.1
2.8 ± 0.2
1.3 ± 0.2
Capacitance change with temperature
Not to exceed −12% at −55°C, +12% at
85°C, and +15% at 125°C
0.5 C
Tangent of loss angle (at 20°C, 120 Hz)
Refer to Standard Ratings
DC leakage current (at 20°C)
0.01 C•V (1) µA or 0.5 µA, whichever is greater
µF
DC Rated
Voltage
(Vdc)
4
6.3
10
10
Equivalent series resistance (ESR)(at 20°C, 100 kHz)
Refer to Standard Ratings
B2
Damp heat (90 to 95% RH at 40°C, 56 days (1344 h))
Capacitance change: ± 5% (±12%) (2)
Tangent of loss angle: 150% of initial
requirements
DC leakage current:
initial requirements
15
22
B2
C
33
C
47
C
68
100
Endurance (at 85°C, DC rated voltage, 2000 h)
Capacitance change: ±10% (±12%) (2)
Tangent of loss angle: initial requirements
DC leakage current:
125% of
initial requirements
D
150
D
220
D
330
D
D
D
Resistance to soldering heat
(solder reflow at 260°C, 10 s. or
solder dip at 260°C, 5 s.)
Capacitance change: ±5% (±12%) (2)
Tangent of loss angle: initial requirements
DC leakage current:
initial requirements
Note 1 Product of capacitance in µF and voltage in V.
2 Capacitance change of ±12% applies to 10 V/150 µF,
6.3 V/220 µF, 4 V/330 µF products in D case.
See pages 25 and 26 for taping specifications.
EC0171EJUV0SG00
23