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HCPL-0930-000E

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HCPL-9000/-0900, -9030/-0930, HCPL-9031/-0931, -900J/-090J, HCPL-901J/-091J, -902J/-092J High Speed Digital Isolators Data Sheet Lead (Pb) Free RoHS 6 fully compliant RoHS 6 fully compliant options available; -xxxE denotes a lead-free product Description Features The HCPL-90xx and HCPL-09xx CMOS digital isolators feature high speed performance and excellent transient immunity specifications. The symmetric magnetic coupling barrier gives these devices a typical pulse width ­ distortion of 2 ns, a typical propagation delay skew of 4 ns and 100 Mbaud data rate, making them the industry’s fastest digital isolators. • +3.3V and +5V TTL/CMOS compatible The single channel digital isolators (HCPL-9000/ -0900) features an active-low logic output enable. The dual channel digital isolators are configured as u ­ nidirectional (HCPL-9030/-0930) and bi-directional (HCPL-9031/-0931), operating in full duplex mode making it ideal for digital fieldbus applications. The quad channel digital isolators are configured as unidirectional (HCPL-900J/-090J), two channels in one direction and two channels in opposite direction (HCPL901J/-091J), and one channel in one direction and three channels in opposite direction (HCPL-902J/-092J). These high channel density make them ideally suited ­ to isolating data conversion devices, parallel buses and peripheral interfaces. • 3 ns max. pulse width distortion • 6 ns max. propagation delay skew • 15 ns max. propagation delay • High speed: 100 MBd • 15 kV/µs min. common mode rejection • Tri-state output (HCPL-9000/-0900) • 2500 V RMS isolation • UL1577 and IEC 61010-1 approved Applications • Digital fieldbus isolation • Multiplexed data transmission • Computer peripheral interface • High speed digital systems • Isolated data interfaces • Logic level shifting They are available in 8-pin PDIP, 8-pin Gull Wing, 8‑pin SOIC packages, and 16–pin SOIC narrow-body and wide-body packages. They are specified over the temperature range of -40°C to +100°C. CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD.

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