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HD6413003F16
FMXMC2S SERIES Surface Mount Ceramic Pkg. Micro 3.2 x 2.5 / Ultra Thin Microprocessor Crystals High Reliability CERAMIC SMD 3.2x2.5 Tight Stability Actual Size SPECIFICATIONS Issue 6 - 07252012 Parameter Specification Frequency Range Operation Mode Load Capacitance (CL) Frequency Tolerance Temperature Tolerance Operating Temperature Storage Temperature Equivalent Series Resistance (ESR) Shunt Capacitance (C0) Drive Level Aging @ 25°C Insulation Resistance Reflow Conditions 12 - 50 MHz See Operation Mode and ESR Table 18 pF Std, 8 - 60 pF and Series available ±30 ppm @ 25°C Std (See Cal. Tol. for Options) ±50 ppm Std (See Temp. Tol. for Options) -10 to +60°C Std (See Temp. Range for Options) -40 to +85°C See Operation Mode and ESR Table 5 pF max 10 µW typical, 200 µW max ±5 ppm per year max 500MΩ min at 100VDC ±15V +260ºC ±10ºC for 10 sec max 2 reflows max 3.2 x 2.5 CERAMIC SMD All specifications subject to change without notice. PIN FUNCTION TABLE Pin Function 1 2 3 4 Crystal Ground Crystal Ground OPERATION MODE AND ESR TABLE Frequency (MHz) 12 16 20 24 - 15.99 19.99 23.99 50.00 Mode Max. ESR (Ohms) Fundamental Fundamental Fundamental Fundamental 100 80 60 40 STANDARD MARKING FMI XX.XXX XX.XXX FREQUENCY in MHz NOTE: Standard Specifications for product indicated in color Dimensions: millimeters PART DESCRIPTION SYSTEM MARKING: See Page 52, Format A FMXM C2S 1 18 H J A - XX.XXXXXXM - CM Frequency (MHz) Product Family MicroP Crystal Package Ceramic SMD 2.5 x 3.2mm Mode 1 - Fundamental Cal. Tol. @ 25°C Load Cap. (CL) 18 - Standard (pF) 00 - Series XX - Custom (pF) D F H J K X ±10 ppm ±20 ppm ±30 ppm ±50 ppm ±100 ppm Custom Temp. Tol. D ±10 ppm F ±20 ppm H ±30 ppm J ±50 ppm K ±100 ppm X Custom Temp. Range A 0 to 70 °C B -20 to 70 °C C *-40 to 85 °C D -10 to 50 °C E -10 to 60 °C F *-30 to 60 °C J 0 to 50 °C X Custom Options TR - Tape & Reel PD - Parameter Data TD - Temp. Data TG - Temp. Grading CM - Custom Mark BLANK - None Req’d. 1-800-800-XTAL [9825] www.fmi-inc.com 16
HITACHI
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RENESAS
ルネサス エレクトロニクス株式会社
日本
2010年（平成22年）4月に設立された大手半導体メーカー。半導体製品の研究開発・製造・販売・サービス。主力製品は、マイコン(CISC、RISC)、パワーデバイス、アナログ＆ミックスドシグナルIC、汎用IC、高周波デバイス、光半導体、車載用LSI、産業用LSI、メモリ、ASIC、USB ASSP、システムLSI
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