2Gb, 4Gb, 8Gb: x8, x16 NAND Flash Memory
Features
NAND Flash Memory
MT29F2G08AACWP, MT29F4G08BACWP, MT29F8G08FACWP
For the latest data sheet, refer to the Micron Web site: www.micron.com/products/nand/
Features
Figure 1:
• Organization
– Page size x8: 2,112 bytes (2,048 + 64 bytes)
– Page size x16: 1,056 words (1,024 + 32 words)
– Block size: 64 pages (128K + 4K bytes)
– Device size: 2Gb: 2,048 blocks; 4Gb: 4,096 blocks;
8Gb: 8,192 blocks
• READ performance
– Random READ: 25µs
– Sequential READ: 30ns (3V x8 only)
• WRITE performance
– PROGRAM PAGE: 300µs (TYP)
– BLOCK ERASE: 2ms (TYP)
• Endurance: 100,000 PROGRAM/ERASE cycles
• First block (block address 00h) guaranteed to be
valid without ECC (up to 1,000 PROGRAM/ERASE
cycles)
• VCC: 1.70V–1.95V1 or 2.7V–3.6V
• Automated PROGRAM and ERASE
• Basic NAND Flash command set:
– PAGE READ, READ for INTERNAL DATA MOVE,
RANDOM DATA READ, READ ID, READ STATUS,
PROGRAM PAGE, RANDOM DATA INPUT, PROGRAM PAGE CACHE MODE, PROGRAM for
INTERNAL DATA MOVE, BLOCK ERASE, RESET
• New commands:
– PAGE READ CACHE MODE
– One-time programmable (OTP), including:
OTP DATA PROGRAM, OTP DATA PROTECT,
OTP DATA READ
– READ UNIQUE ID (contact factory)
– READ ID2 (contact factory)
• Operation status byte provides a software method of
detecting:
– PROGRAM/ERASE operation completion
– PROGRAM/ERASE pass/fail condition
– Write-protect status
• READY/BUSY (R/B#) pin provides a hardware
method of detecting PROGRAM or ERASE cycle
completion
• WP# pin: hardware write protect
PDF: 09005aef814b01a2 / Source: 09005aef814b01c7
2_4_8gb_nand_m49a__1.fm - Rev. C 10/06 EN
Options
48-Pin TSOP Type 1
Marking
• Density:
– 2Gb (single die)
MT29F2G
– 4Gb (dual-die stack)
MT29F4G
– 8Gb (quad-die stack)
MT29F8G
• Device width:
– x8
MT29Fxx08x
– x161
MT29Fxx16x
• Configuration:
# of die # of CE# # of R/B#
1
1
1
A
2
1
1
B
4
2
2
F
• VCC:
– 2.7V–3.6V
A
– 1.70V–1.95V1
B
• Third-generation die
C
• Package:
– 48-Pin TSOP type I (lead-free)
WP
• Operating temperature:
– Commercial (0°C to 70°C)
None
– Extended (–40°C to +85°C)2
ET
Notes: 1. Packaged parts are only available for 3V x8
devices. For 1.8V or x16 devices, contact
factory.
2. For ET devices, contact factory.
1
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2005 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.