High Resolution Optical
Reflective Sensor
Technical Data
HBCS-1100
Features
• Focused Emitter and
Detector in a Single Package
• High Resolution–0.190 mm
Spot Size
• 700 nm Visible Emitter
• Lens Filtered to Reject
Ambient Light
• TO-5 Miniature Sealed
Package
• Photodiode and Transistor
Output
• Solid State Reliability
Description
The HBCS-1100 is a fully integrated module designed for
optical reflective sensing. The
module contains a 0.178 mm
(0.007 in.) diameter 700 nm
visible LED emitter and a
matched I.C. photodetector. A
bifurcated aspheric lens is used
to image the active areas of the
emitter and the detector to a
single spot 4.27 mm (0.168 in.)
in front of the package. The
reflected signal can be sensed
directly from the photodiode or
through an internal transistor
that can be configured as a high
gain amplifier.
Applications
Applications include pattern
recognition and verification,
object sizing, optical limit
switching, tachometry, textile
thread counting and defect
detection, dimensional monitoring, line locating, mark, and bar
code scanning, and paper edge
detection.
Mechanical
Considerations
The HBCS-1100 is packaged in a
high profile 8 pin TO-5 metal can
with a glass window. The emitter
and photodetector chips are
mounted on the header at the
base of the package. Positioned
above these active elements is a
bifurcated aspheric acrylic lens
that focuses them to the same
point.
Package Dimensions
9.40 (0.370)
8.51 (0.335)
MAXIMUM
SIGNAL POINT
S.P.
R.P.
0.86 (0.034)
0.73 (0.029)
8.33 (0.328)
7.79 (0.307)
C
L
5.08
(0.200)
12.0
(0.473)
REFERENCE
PLANE
4.27 ± 0.25
(0.168 ± 0.010)
4.11
(0.162)
1.14 (0.045)
0.73 (0.029)
15.24 (0.600)
12.70 (0.500)
5.08
(0.200)
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS AND (INCHES).
2. ALL UNTOLERANCED DIMENSIONS ARE FOR REFERENCE ONLY.
3. THE REFERENCE PLANE IS THE TOP SURFACE OF THE PACKAGE.
4. NICKEL CAN AND GOLD PLATED LEADS.
5. S.P. SEATING PLANE.
6. THE LEAD DIAMETER IS 0.45 mm (0.018 IN.) TYP.
11.50 (0.453)
11.22 (0.442)
